Intel E8501 manual 7.5.1Heatsink Orientation, 7.5.2Extruded Heatsink Profiles

Models: E8501

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7.5.1Heatsink Orientation

NB Reference Thermal Solution #2

Figure 7-3. Second NB Heatsink Assembly

7.5.1Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.

7.5.2Extruded Heatsink Profiles

Please refer to Section 6.5.2 for detail.

7.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.4Thermal Interface Material

Please refer to Section 6.5.4 for detail.

7.5.4.1Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

7.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.

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Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

 

Bridge (XMB) Thermal/Mechanical Design Guide

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Intel E8501 manual 7.5.1Heatsink Orientation, 7.5.2Extruded Heatsink Profiles, 7.5.3Mechanical Interface Material