Intel E8501 Thermal Solution Component Suppliers, Bridge XMB Thermal/Mechanical Design Guide

Models: E8501

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Thermal Solution Component Suppliers

Table A-3.

XMB Heatsink Thermal Solution

 

 

 

 

 

 

 

 

 

 

 

Part

Intel Part Number

 

Supplier

Contact Information

 

 

 

(Part Number)

 

 

 

 

 

 

 

 

 

 

 

Heatsink Assembly includes:

C23124-001

 

CCI/ACK

Harry Lin (USA)

Unidirectional Fin Heatsink

 

 

 

714-739-5797

Thermal Interface Material

 

 

 

hlinack@aol.com

 

 

 

 

Retaining Fastener

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Unidirectional Fin Heatsink

C19222-001

 

CCI/ACK

Harry Lin (USA)

(64.52 x 64.52 x 50.8 mm)

 

 

 

714-739-5797

 

 

 

 

 

 

hlinack@aol.com

 

 

 

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Thermal Interface

689850-001

 

Chomerics

Todd Sousa (USA)

(T-710)

 

 

 

(69-12-22000-T710)

360-606-8171

 

 

 

 

 

 

tsousa@parker.com

 

 

 

 

 

Retaining Fastener

-

 

ITW Fastex*

Ron Schmidt (USA)

 

 

 

 

 

(8034-00-9909)

847-299-2222

 

 

 

 

 

 

rschmidt@itwfastex.com

 

 

 

 

 

 

Henry Lu (Taiwan)

 

 

 

 

 

 

(886) 7-811-9206 Ext. 10

 

 

 

 

 

 

henry@mail.itwasia.com.tw

 

 

 

 

 

 

 

NOTE: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.

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Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory

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Bridge (XMB) Thermal/Mechanical Design Guide

 

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Intel E8501 manual Thermal Solution Component Suppliers, Bridge XMB Thermal/Mechanical Design Guide, Intel Part Number