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Intel E8501 manual 6.3Mechanical Design Envelope, NB Reference Thermal Solution #1

Models: E8501

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NB Reference Thermal Solution #1

Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs. Approach Velocity

	1.50	Ȍ
	1.40
(°C/W)	1.30
	1.20
	1.10
Ȍca	1.10
Ȍca	1.00
	1.00
	0.90
	0.80
	100	200	300	400	500	600	700

Flow Rate (LFM)

6.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset NB thermal solution are shown in Figure 6-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 4.14 mm (0.16 in.) in height.

24	Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

Page 24

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Intel E8501 manual 6.3Mechanical Design Envelope, NB Reference Thermal Solution #1

Contents

Thermal/Mechanical Design Guide Document NumberIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Thermal Solution Component Suppliers FiguresMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideTables Bridge XMB Thermal/Mechanical Design GuideRevision History Bridge XMB Thermal/Mechanical Design GuideDocument Revision1Introduction 1.1Design Flow1.2Definition of Terms IntroductionFigure 1-1.Thermal Design Process •Intel E8501 Chipset North Bridge NB Datasheet •Intel E8500 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsIntroduction Bridge XMB Thermal/Mechanical Design Guide2Packaging Technology Figure 2-1.NB Package Dimensions Top ViewFigure 2-2.NB Package Dimensions Side View Packaging Technology Figure 2-3.NB Package Dimensions Bottom ViewBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-4.XMB Package Dimensions Top View Figure 2-5.XMB Package Dimensions Side ViewPackaging Technology Bridge XMB Thermal/Mechanical Design Guide2.1Package Mechanical Requirements Figure 2-6.XMB Package Dimensions Bottom ViewPackaging Technology 3Thermal Specifications 3.1Thermal Design Power TDP3.2Die Case Temperature Specifications Thermal Specifications 4Thermal Simulation Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide5Thermal Metrology 5.1Die Case Temperature MeasurementsThermal Metrology Figure 5-1.Thermal Solution Decision Flowchart5.2Power Simulation Software Thermal MetrologyThermal Metrology Bridge XMB Thermal/Mechanical Design Guide6NB Reference Thermal Solution #1 6.1Operating Environment6.2Heatsink Performance NB Reference Thermal Solution #1 6.3Mechanical Design Envelope6.4Board-LevelComponents Keepout Dimensions MotherboardNB Reference Thermal Solution #1 Heatsink6.5First NB Heatsink Thermal Solution Assembly TNBLocationNB Reference Thermal Solution #1 6.5.1Heatsink Orientation 6.5.2Extruded Heatsink Profiles6.5.3Mechanical Interface Material 6.5.4Thermal Interface Material6.5.5Heatsink Retaining Fastener NB Reference Thermal Solution #1Figure 6-5.First NB Heatsink Extrusion Profile 6.6Reliability Guidelines NB Reference Thermal Solution #1Bridge XMB Thermal/Mechanical Design Guide TestNB Reference Thermal Solution #1 Bridge XMB Thermal/Mechanical Design Guide7NB Reference Thermal Solution #2 7.1Operating Environment7.2Heatsink Performance NB Reference Thermal Solution #2 7.3Mechanical Design Envelope7.4Board-LevelComponents Keepout Dimensions 7.5Second NB Heatsink Thermal Solution AssemblyNB Reference Thermal Solution #2 Motherboard7.5.1Heatsink Orientation 7.5.2Extruded Heatsink Profiles7.5.3Mechanical Interface Material 7.5.4Thermal Interface Material7.6Reliability Guidelines NB Reference Thermal Solution #2Please refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideNB Reference Thermal Solution #2 Bridge XMB Thermal/Mechanical Design Guide8XMB Reference Thermal Solution 8.1Operating Environment8.2Heatsink Performance 8.4Board-LevelComponents Keepout Dimensions 8.5XMB Heatsink Thermal Solution AssemblyXMB Reference Thermal Solution 8.3Mechanical Design Envelope8.5.1Heatsink Orientation XMB LocationXMB Reference Thermal Solution 8.5.2Extruded Heatsink Profiles 8.5.3Mechanical Interface Material8.5.4Thermal Interface Material 8.5.5Heatsink Retaining Fastener8.6Reliability Guidelines XMB Reference Thermal SolutionFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideXMB Reference Thermal Solution Bridge XMB Thermal/Mechanical Design GuideAThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuidePart Intel Part NumberThermal Solution Component Suppliers Bridge XMB Thermal/Mechanical Design GuideB Mechanical Drawings Table B-1.Mechanical Drawing ListBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionMechanical Drawings Figure B-1.NB Heatsink #1 Assembly DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-2.NB Heatsink #1 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-4.NB Heatsink #2 DrawingBridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly Drawing Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Figure B-6.XMB Heatsink DrawingBridge XMB Thermal/Mechanical Design Guide Mechanical Drawings Bridge XMB Thermal/Mechanical Design Guide