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Intel E8501 manual 4Thermal Simulation

Models: E8501

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4Thermal Simulation

Intel provides thermal simulation models of the E8500/E8501 chipset NB/XMB components and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in ICEPAK* format. Contact your Intel field sales representative to order the thermal models and user's guides.

Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory	17
Bridge (XMB) Thermal/Mechanical Design Guide

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Contents

Document Number Thermal/Mechanical Design GuideIntel E8500/E8501 Chipset North Bridge NB and eXternal Memory Bridge XMBBridge XMB Thermal/Mechanical Design Guide Contents Figures Thermal Solution Component SuppliersMechanical Drawings Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide TablesBridge XMB Thermal/Mechanical Design Guide Revision HistoryDocument Revision1.1Design Flow 1IntroductionFigure 1-1.Thermal Design Process 1.2Definition of TermsIntroduction •Intel E8500 Chipset North Bridge NB Datasheet •Intel E8501 Chipset North Bridge NB Datasheet•BGA/OLGA Assembly Development Guide 1.3Reference DocumentsBridge XMB Thermal/Mechanical Design Guide IntroductionFigure 2-2.NB Package Dimensions Side View 2Packaging TechnologyFigure 2-1.NB Package Dimensions Top View Figure 2-3.NB Package Dimensions Bottom View Packaging TechnologyBridge XMB Thermal/Mechanical Design Guide NOTESFigure 2-5.XMB Package Dimensions Side View Figure 2-4.XMB Package Dimensions Top ViewPackaging Technology Bridge XMB Thermal/Mechanical Design GuideFigure 2-6.XMB Package Dimensions Bottom View 2.1Package Mechanical RequirementsPackaging Technology Notes3.2Die Case Temperature Specifications 3Thermal Specifications3.1Thermal Design Power TDP Thermal Specifications 4Thermal Simulation Bridge XMB Thermal/Mechanical Design Guide Thermal Simulation5Thermal Metrology 5.1Die Case Temperature MeasurementsFigure 5-1.Thermal Solution Decision Flowchart Thermal MetrologyThermal Metrology 5.2Power Simulation SoftwareBridge XMB Thermal/Mechanical Design Guide Thermal Metrology6.2Heatsink Performance 6NB Reference Thermal Solution #16.1Operating Environment 6.3Mechanical Design Envelope NB Reference Thermal Solution #1Motherboard 6.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #1 HeatsinkNB Reference Thermal Solution #1 6.5First NB Heatsink Thermal Solution AssemblyTNBLocation 6.5.2Extruded Heatsink Profiles 6.5.1Heatsink Orientation6.5.3Mechanical Interface Material 6.5.4Thermal Interface MaterialFigure 6-5.First NB Heatsink Extrusion Profile 6.5.5Heatsink Retaining FastenerNB Reference Thermal Solution #1 NB Reference Thermal Solution #1 6.6Reliability GuidelinesBridge XMB Thermal/Mechanical Design Guide TestBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #17.2Heatsink Performance 7NB Reference Thermal Solution #27.1Operating Environment 7.3Mechanical Design Envelope NB Reference Thermal Solution #27.5Second NB Heatsink Thermal Solution Assembly 7.4Board-LevelComponents Keepout DimensionsNB Reference Thermal Solution #2 Motherboard7.5.2Extruded Heatsink Profiles 7.5.1Heatsink Orientation7.5.3Mechanical Interface Material 7.5.4Thermal Interface MaterialNB Reference Thermal Solution #2 7.6Reliability GuidelinesPlease refer to Section 6.6 for detail § Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide NB Reference Thermal Solution #28.2Heatsink Performance 8XMB Reference Thermal Solution8.1Operating Environment 8.5XMB Heatsink Thermal Solution Assembly 8.4Board-LevelComponents Keepout DimensionsXMB Reference Thermal Solution 8.3Mechanical Design EnvelopeXMB Reference Thermal Solution 8.5.1Heatsink OrientationXMB Location 8.5.3Mechanical Interface Material 8.5.2Extruded Heatsink Profiles8.5.4Thermal Interface Material 8.5.5Heatsink Retaining FastenerXMB Reference Thermal Solution 8.6Reliability GuidelinesFigure 8-5.XMB Heatsink Extrusion Profile Bridge XMB Thermal/Mechanical Design GuideBridge XMB Thermal/Mechanical Design Guide XMB Reference Thermal SolutionBridge XMB Thermal/Mechanical Design Guide AThermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersPart Intel Part NumberBridge XMB Thermal/Mechanical Design Guide Thermal Solution Component SuppliersTable B-1.Mechanical Drawing List B Mechanical DrawingsBridge XMB Thermal/Mechanical Design Guide Drawing DescriptionBridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-1.NB Heatsink #1 Assembly Drawing Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-2.NB Heatsink #1 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-3.NB Heatsink #2 Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-4.NB Heatsink #2 Drawing Bridge XMB Thermal/Mechanical Design Guide Figure B-5.XMB Heatsink Assembly DrawingMechanical Drawings Bridge XMB Thermal/Mechanical Design Guide Mechanical DrawingsFigure B-6.XMB Heatsink Drawing Bridge XMB Thermal/Mechanical Design Guide Mechanical Drawings