Lenovo RD120 manual Removing the DIMM air baffle, Finger hole, Release ring

Removing the DIMM air baffle

When you work with some optional devices, you must first remove the DIMM air baffle to access certain components or connectors on the system board. The following illustration shows how to remove the DIMM air baffle.

1	DIMM air baffle
2	Riser card assembly
3	Finger hole
4	Release ring

To remove the DIMM air baffle, complete the following steps:

1.Read the safety information that begins on page v and “Installation guidelines” on page 29.

2.Turn off the server and peripheral devices and disconnect all power cords and external cables (see “Turning off the server” on page 12).

Attention: In a dc power environment, only trained service personnel other than Lenovo service technicians are authorized to connect or disconnect power to the dc power supply. See the documentation that comes with each dc power supply.

3.Remove the cover (see “Removing the cover” on page 31).

4.Remove the riser-card assembly (see “Removing the riser-card assembly” on page 32).

5.Place your fingers into the handle
4 and finger hole on the top of the air baffle.

Chapter 2. Installing optional devices 37