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Nexus 21 1066MT/s Interposer, DDR3 800, NEX DDR3INTR THIN 3.5.1 Samtec connector on the LEASH probe pins

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The strain relief on the LEASH to NEXPRB1X/2X interface, while designed for bench handling, can be damaged by twisting the coax cables. Bends of over 45 degrees in this area should be avoided. The coax connection points, under any circumstances, are not to be bent.

3.5.1 Samtec connector on the LEASH probe pins

Figure 2 – Samtec connector on the LEASH probe

The LEASH probe connects to the NEX-PRB1X-T or NEX-PRB2X-T probe using two plastic nuts and screws, with a plastic spacer between the two boards. These parts are supplied.

DDR3THIN-MN-XXX

Doc. Rev. 1.11

Contents

Page Limitation of Warranty Exclusive Remedies Software License Agreement License Agreement TABLE OF CONTENTS Page TABLE OF FIGURES TABLE OF TABLES Page 1.0OVERVIEW 1.1General Information 1.2 Software Package description B_DDR3D_2D Optional NEX-DDR3INTR-THIN 1.3 Eye size required 2.0 SOFTWARE INSTALLATION Okay 3.0CONNECTING to the NEX-DDR3INTR-THININTERPOSER 3.1General 3.2 B_DDR3D_2D Support TLA Master TLA Slave 3.4 B_DDR3D_3A Support two three TLA Slave1 TLA Slave2 3.5 Short “LEASH” probes 3.5.1 Samtec connector on the LEASH probe pins 3.5.2 LEASH probe to NEX-PRB1X/2Xconnection 3.5.3 Alternate use of NEX-PRB1Xor NEX-PRB2Xprobes 3.6 Slot Numbering Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page 3.7 Display Groups not in Tables 1,2 or 4.0CLOCK SELECTION 4.1B_DDR3D_2D Clocking Selections SDRAM Clocking: S0#; Every Rising Edge S0# & S1#; Every Rising Edge Refresh Cycles: Acquire Do Not Acquire NOTE: 4.2 B_DDR3D_2G Clocking Selections C:____B:_0__A:___0 0r1r1r – C:____B:_0__A:__10 0r1r2r – C:____B:10__A:___0 4.3 B_DDR3D_3A Clocking Selections SDRAM DDR CLK0 Clocking: 5.0 CONFIGURING FOR READ / WRITE DATA ACQUISITION 5.1 A Note About the Different Data Groups 5.2 MagniVu Signals Page Page Page Page Page Page Page Page 5.3 Adjusting Input Thresholds for Proper Data Acquisition 5.4 DDR3 and DDR3SPA 5.5 Selecting B_DDR3E_XX Read Data Sample Points 5.6 Selecting B_DDR3D_XX Write Data Sample Points NOTE 5.7 B_DDR3D_XX Support Setup Page Page Page Page Page Page 5.8 Setting B_DDR3D_3A Read Data Sample Points 6.0VIEWING DATA 6.1Viewing B_DDR3D_XX Data Burst Length CAS Latency (CL) CAS Additive Latency CAS Write Latency Registered DM Signal Use Show Hardware Software Control Flow 6.2 Viewing Raw DDR3 Data using B_DDR3D_XX Supports 6.3 B_DDR3D_2A / 3A Mnemonics Description Mnemonic Description 6.4 B_DDR3D_2G Mnemonics Description 6.5 Viewing Timing Data on the TLA Window New Data Window Waveform Window Type Page 7.0HINTS & TIPS 7.1Symbolic Triggering on a Command using B_DDR3D_XX Supports Symbol Definition 7.3 Capturing MRS (Mode Register Set) Cycles 7.4 Clock Capture quality 7.5 Thresholds APPENDIX A – How DDR Data is Clocked A.1 Background and A.2 DDR Acquisition - General A.3 B_DDR3D_2D / 2G / 3A Data Acquisition Write Wa Wb Wc Wd We APPENDIX B - Considerations B.1 NEX-DDR3INTR-THINBus Loading B.2 DIMM connector location for best quality signal capture B.3 TLA7BB4 Module to module skew APPENDIX C – 240-pinDDR3 DIMM Pinout APPENDIX C - 240-pinDDR3 DIMM Pinout (cont’d.) APPENDIX D –DataFlow Through the Probes (coax cable to channel) APPENDIX D - Data Flow Through the Probes (cont’d.) APPENDIX E – B_DDR3D_2D Support Pinout, DIMM Slot APPENDIX E – B_DDR3D_2D Support Pinout, DIMM Slot 0 (Cont’d.) APPENDIX F – B_DDR3_2G Support Pinout, DIMM Slot 0 Auxiliary Signals Page APPENDIX G – B_DDR3D_3A Support Pinout, DIMM Slot APPENDIX G – B_DDR3D_3A Support Pinout, DIMM Slot 1 (cont’d.) APPENDIX H – Data Group / Data Byte / Strobe Cross-Reference 32-bitData Group 8-bitData Group Strobe Data Bits Page APPENDIX J – Keep out area APPENDIX K – Simulation Model APPENDIX L - References APPENDIX M - Support About Nexus Technology, Inc Web site: http://www.nexustechnology.com Support Contact Information Technical Support techsupport@nexustechnology.com