Nexus 21 1066MT/s Interposer, DDR3 800, NEX DDR3INTR THIN 60

used as Data Masks then the WrtMasks group should have a Setup & Hold value that matches that of the Write Data groups.

Figure 13 - Setting B_DDR3D_XX WrA_DatHi / Lo and WrB_DatHi / Lo Sample Points

Because of the speeds of DDR3 data it may be necessary to program Setup & Hold values for each of the 8-bit groups that are associated with a given Strobe. This could be required if there is significant skew between the DDR Strobes. Figure 14 shows some of these additional data groups (DataByte7-0) added to the same Waveform display shown in Figure 12. Note that it is now possible to determine the skew between data groups and place these values into the Setup & Hold Window settings in the TLA Setup window (see Figure 15). Refer to Appendix F Data Group / Byte / Strobe Cross-Reference for details on which 8-bit groups make up a 32-bit group.

When setting the individual Setup & Hold values it is suggested that the settings for the associated 32-bit group (RdA_DatHi, RdA_DatLo, RdB_DatHi, RdB_DatLo, WrA_DatHi, WrA_DatLo, WrB_DatHi, WrB_DatLo) be reset to “Support Package Default”. This will prevent the TLA from displaying warnings that conflicting values have been set for the data bits. The Support Package Default Setup & Hold values are the same as the TLA default values – 117ps/117ps. It will also be necessary to program the Setup & Hold values for all of the 8-bit groups in the affected 32-bit group. If conflicting Setup & Hold points are programmed then the values will have exclamation marks beside them to denote the conflict.

DDR3THIN-MN-XXX

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Contents

Page Limitation of Warranty Exclusive Remedies Software License Agreement License Agreement TABLE OF CONTENTS Page TABLE OF FIGURES TABLE OF TABLES Page 1.0OVERVIEW 1.1General Information 1.2 Software Package description B_DDR3D_2D Optional NEX-DDR3INTR-THIN 1.3 Eye size required 2.0 SOFTWARE INSTALLATION Okay 3.0CONNECTING to the NEX-DDR3INTR-THININTERPOSER 3.1General 3.2 B_DDR3D_2D Support TLA Master TLA Slave 3.4 B_DDR3D_3A Support two three TLA Slave1 TLA Slave2 3.5 Short “LEASH” probes 3.5.1 Samtec connector on the LEASH probe pins 3.5.2 LEASH probe to NEX-PRB1X/2Xconnection 3.5.3 Alternate use of NEX-PRB1Xor NEX-PRB2Xprobes 3.6 Slot Numbering Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page Page 3.7 Display Groups not in Tables 1,2 or 4.0CLOCK SELECTION 4.1B_DDR3D_2D Clocking Selections SDRAM Clocking: S0#; Every Rising Edge S0# & S1#; Every Rising Edge Refresh Cycles: Acquire Do Not Acquire NOTE: 4.2 B_DDR3D_2G Clocking Selections C:____B:_0__A:___0 0r1r1r – C:____B:_0__A:__10 0r1r2r – C:____B:10__A:___0 4.3 B_DDR3D_3A Clocking Selections SDRAM DDR CLK0 Clocking: 5.0 CONFIGURING FOR READ / WRITE DATA ACQUISITION 5.1 A Note About the Different Data Groups 5.2 MagniVu Signals Page Page Page Page Page Page Page Page 5.3 Adjusting Input Thresholds for Proper Data Acquisition 5.4 DDR3 and DDR3SPA 5.5 Selecting B_DDR3E_XX Read Data Sample Points 5.6 Selecting B_DDR3D_XX Write Data Sample Points NOTE 5.7 B_DDR3D_XX Support Setup Page Page Page Page Page Page 5.8 Setting B_DDR3D_3A Read Data Sample Points 6.0VIEWING DATA 6.1Viewing B_DDR3D_XX Data Burst Length CAS Latency (CL) CAS Additive Latency CAS Write Latency Registered DM Signal Use Show Hardware Software Control Flow 6.2 Viewing Raw DDR3 Data using B_DDR3D_XX Supports 6.3 B_DDR3D_2A / 3A Mnemonics Description Mnemonic Description 6.4 B_DDR3D_2G Mnemonics Description 6.5 Viewing Timing Data on the TLA Window New Data Window Waveform Window Type Page 7.0HINTS & TIPS 7.1Symbolic Triggering on a Command using B_DDR3D_XX Supports Symbol Definition 7.3 Capturing MRS (Mode Register Set) Cycles 7.4 Clock Capture quality 7.5 Thresholds APPENDIX A – How DDR Data is Clocked A.1 Background and A.2 DDR Acquisition - General A.3 B_DDR3D_2D / 2G / 3A Data Acquisition Write Wa Wb Wc Wd We APPENDIX B - Considerations B.1 NEX-DDR3INTR-THINBus Loading B.2 DIMM connector location for best quality signal capture B.3 TLA7BB4 Module to module skew APPENDIX C – 240-pinDDR3 DIMM Pinout APPENDIX C - 240-pinDDR3 DIMM Pinout (cont’d.) APPENDIX D –DataFlow Through the Probes (coax cable to channel) APPENDIX D - Data Flow Through the Probes (cont’d.) APPENDIX E – B_DDR3D_2D Support Pinout, DIMM Slot APPENDIX E – B_DDR3D_2D Support Pinout, DIMM Slot 0 (Cont’d.) APPENDIX F – B_DDR3_2G Support Pinout, DIMM Slot 0 Auxiliary Signals Page APPENDIX G – B_DDR3D_3A Support Pinout, DIMM Slot APPENDIX G – B_DDR3D_3A Support Pinout, DIMM Slot 1 (cont’d.) APPENDIX H – Data Group / Data Byte / Strobe Cross-Reference 32-bitData Group 8-bitData Group Strobe Data Bits Page APPENDIX J – Keep out area APPENDIX K – Simulation Model APPENDIX L - References APPENDIX M - Support About Nexus Technology, Inc Web site: http://www.nexustechnology.com Support Contact Information Technical Support techsupport@nexustechnology.com