Appendix
B. Specifications
Measurement |
|
Number of Sensors | 2 standard, plus 4 optional |
Frequency Range | 4.0MHz to 6.0Mhz |
Frequency Accuracy | .01% @ 2 rdgs/sec. |
Frequency Resolution | .1 Hz |
Rate Accuracy | .5% typical |
Rate Resolution | .01/.1 Å/s |
Thickness Accuracy | .5% typical |
Thickness Resolution | 1 Å |
Measurement Filter | 1 to 20 readings |
Measurement Period | .15 to 2 sec |
Film Parameters |
|
Stored Films | 9 |
Density | 0.5 – 99.99 gm/cc |
Tooling | 10 – 399 % |
0.10 – 10.00 | |
Final Thickness | 0.000 – 99.99 kÅ |
Thickness Setpoint | 0.000 – 99.99 kÅ |
Time Setpoint | 0:00 – 99:59 sec |
System Parameters |
|
Simulate Mode | On/Off |
Frequency Mode | On/Off |
Etch Mode | On/Off |
Crystal Fail Minimum. | 4.0 to 6.0 MHz |
Crystal Fail Maximum | 4.1 to 6.1 MHz |
2.4/4.8/9.6/19.2 kb/s | |
General Specifications |
|
Power Supply | |
Power Consumption | 20VA |
Operating Environment | 0°C to 50°C |
| 0 to 80% RH |
Storage Environment | |
Operating Altitude | 0 to 2,000 meters |
Rack Dimensions (HxWxD) | 88.5mm x 212.7mm x 196.9mm |
Weight | 13.2 kg (6 lbs) |
Accessories | Power Cord, Rack Mount Ears, |
| Relay I/O Connector, |
| MonComm Software, Manual |
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