Appendix
B. Specifications
Measurement | 
  | 
Number of Sensors  | 2 standard, plus 4 optional  | 
Frequency Range  | 4.0MHz to 6.0Mhz  | 
Frequency Accuracy  | .01% @ 2 rdgs/sec.  | 
Frequency Resolution  | .1 Hz  | 
Rate Accuracy  | .5% typical  | 
Rate Resolution  | .01/.1 Å/s  | 
Thickness Accuracy  | .5% typical  | 
Thickness Resolution  | 1 Å  | 
Measurement Filter  | 1 to 20 readings  | 
Measurement Period  | .15 to 2 sec  | 
Film Parameters | 
  | 
Stored Films  | 9  | 
Density  | 0.5 – 99.99 gm/cc  | 
Tooling  | 10 – 399 %  | 
0.10 – 10.00  | |
Final Thickness  | 0.000 – 99.99 kÅ  | 
Thickness Setpoint  | 0.000 – 99.99 kÅ  | 
Time Setpoint  | 0:00 – 99:59 sec  | 
System Parameters | 
  | 
Simulate Mode  | On/Off  | 
Frequency Mode  | On/Off  | 
Etch Mode  | On/Off  | 
Crystal Fail Minimum.  | 4.0 to 6.0 MHz  | 
Crystal Fail Maximum  | 4.1 to 6.1 MHz  | 
2.4/4.8/9.6/19.2 kb/s  | |
General Specifications | 
  | 
Power Supply  | |
Power Consumption  | 20VA  | 
Operating Environment  | 0°C to 50°C  | 
  | 0 to 80% RH   | 
Storage Environment  | |
Operating Altitude  | 0 to 2,000 meters  | 
Rack Dimensions (HxWxD)  | 88.5mm x 212.7mm x 196.9mm  | 
Weight  | 13.2 kg (6 lbs)  | 
Accessories  | Power Cord, Rack Mount Ears,  | 
  | Relay I/O Connector,   | 
  | MonComm Software, Manual  | 
  | 
  |