Cypress CY7C1320CV18-250BZC, 001-07160 manual Features, Functional Description, Configurations

CY7C1318CV18

CY7C1320CV18

18-Mbit DDR II SRAM 2-Word Burst Architecture

Features

■18-Mbit Density (1M x 18, 512K x 36)

■267 MHz Clock for high Bandwidth

■2-word Burst for reducing Address Bus Frequency

■Double Data Rate (DDR) Interfaces (data transferred at 534 MHz) at 267 MHz

■Two Input Clocks (K and K) for precise DDR Timing ❐ SRAM uses rising edges only

■Two Input Clocks for Output Data (C and C) to minimize Clock Skew and Flight Time mismatches

■Echo Clocks (CQ and CQ) simplify Data Capture in High Speed Systems

■Synchronous internally Self-timed Writes

■DDR II operates with 1.5 Cycle Read Latency when the DLL is enabled

■Operates similar to a DDR I Device with one Cycle Read Latency in DLL Off Mode

■1.8V Core Power Supply with HSTL Inputs and Outputs

■Variable drive HSTL Output Buffers

■Expanded HSTL Output Voltage (1.4V–VDD)

■Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)

■Offered in both Pb-free and non Pb-free Packages

■JTAG 1149.1 compatible Test Access Port

■Delay Lock Loop (DLL) for accurate Data Placement

Functional Description

The CY7C1318CV18, and CY7C1320CV18 are 1.8V Synchronous Pipelined SRAMs equipped with DDR II archi- tecture. The DDR II consists of an SRAM core with advanced synchronous peripheral circuitry and a one-bit burst counter. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. For CY7C1318CV18 and CY7C1320CV18, the burst counter takes in the least significant bit of the external address and bursts two 18-bit words (in the case of CY7C1318CV18) of two 36-bit words (in the case of CY7C1320CV18) sequentially into or out of the device.

Asynchronous inputs include an output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs, D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need to capture data separately from each individual DDR SRAM in the system design. Output data clocks (C/C) enable maximum system clocking and data synchronization flexibility.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

CY7C1318CV18 – 1M x 18

CY7C1320CV18 – 512K x 36

Selection Guide

Description		267 MHz	250 MHz	200 MHz	167 MHz	Unit
Maximum Operating Frequency		267	250	200	167	MHz
Maximum Operating Current	x18	805	730	600	510	mA
	x36	855	775	635	540

Cypress Semiconductor Corporation • 198 Champion Court	•	San Jose, CA 95134-1709	•	408-943-2600
Document Number: 001-07160 Rev. *F		Revised August 24, 2009

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