Cypress CY7C1318CV18-200BZXC, CY7C1320CV18-200BZC Write Cycle Descriptions, Operation, Comments

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CY7C1318CV18

CY7C1320CV18

Truth Table

The truth table for the CY7C1318CV18, and CY7C1320CV18 follows.[2, 3, 4, 5, 6, 7]

Operation

K

LD

R/W

DQ

DQ

Write Cycle:

L-H

L

L

D(A1) at K(t + 1)

D(A2) at

 

 

K(t + 1)

Load address; wait one cycle;

 

 

 

 

 

 

 

 

 

input write data on consecutive K and

K

rising edges.

 

 

 

 

 

 

 

 

 

Read Cycle:

L-H

L

H

Q(A1) at

 

 

Q(A2) at C(t + 2)

C(t + 1)

Load address; wait one and a half cycle;

 

 

 

 

 

 

 

 

 

read data on consecutive C and C rising edges.

 

 

 

 

 

 

 

 

 

NOP: No Operation

L-H

H

X

High-Z

High-Z

Standby: Clock Stopped

Stopped

X

X

Previous State

Previous State

Burst Address Table

(CY7C1318CV18, CY7C1320CV18)

First Address (External)

Second Address (Internal)

X..X0

X..X1

 

 

X..X1

X..X0

 

 

Write Cycle Descriptions

The write cycle description table for CY7C1318CV18 follows. [2, 8]

BWS0

BWS1

K

K

Comments

L

L

L–H

During the data portion of a write sequence :

 

 

 

 

Both bytes (D[17:0]) are written into the device.

L

L

L-H

During the data portion of a write sequence :

 

 

 

 

Both bytes (D[17:0]) are written into the device.

L

H

L–H

During the data portion of a write sequence :

 

 

 

 

Only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.

L

H

L–H

During the data portion of a write sequence :

 

 

 

 

Only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.

H

L

L–H

During the data portion of a write sequence :

 

 

 

 

Only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.

H

L

L–H

During the data portion of a write sequence :

 

 

 

 

Only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.

H

H

L–H

No data is written into the devices during this portion of a write operation.

 

 

 

 

 

H

H

L–H

No data is written into the devices during this portion of a write operation.

 

 

 

 

 

Notes

2.X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.

3.Device powers up deselected with the outputs in a tristate condition.

4.On CY7C1318CV18 and CY7C1320CV18, “A1” represents address location latched by the devices when transaction was initiated and “A2” represents the addresses sequence in the burst.

5.“t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.

6.Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.

7.It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically.

8.Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. BWS0, BWS1, BWS2, and BWS3 can be altered on different portions of a write cycle, as long as the setup and hold requirements are achieved.

Document Number: 001-07160 Rev. *F

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Contents Features ConfigurationsFunctional Description Selection GuideLogic Block Diagram CY7C1318CV18 Logic Block Diagram CY7C1320CV18Pin Configuration Ball Fbga 13 x 15 x 1.4 mm PinoutCY7C1318CV18 1M x CY7C1320CV18 512K xPin Definitions Pin Name Pin DescriptionSynchronous Read/Write Input. When Referenced with Respect toPower Supply Inputs to the Core of the Device Power Supply Inputs for the Outputs of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Application Example Programmable ImpedanceEcho Clocks SRAM#1 ZQWrite Cycle Descriptions OperationFirst Address External Second Address Internal CommentsWrite cycle description table for CY7C1320CV18 follows.2 DeviceInto the device. D359 remains unaltered Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller follows.9TAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDDLL Constraints Power Up Sequence in DDR II SramPower Up Sequence Neutron Soft Error Immunity Electrical CharacteristicsDC Electrical Characteristics Maximum RatingsAC Electrical Characteristics CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitParameter Min Max Parameter Min Max Output Times DLL TimingSwitching Waveforms Read/Write/Deselect Sequence26, 27CY7C1320CV18-167BZC Document Number 001-07160 Rev. *F Ordering InformationCY7C1320CV18-267BZXC Package Diagram Ball Fbga 13 x 15 x 1.4 mmDocument History Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products