Cypress CY7C1357C, CY7C1355C manual Soldernotespad Type NON-SOLDER Mask Defined Nsmd

Page 27

CY7C1355C

CY7C1357C

Package Diagrams (continued)

 

 

 

 

 

 

 

 

165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BOTTOM VIEW

 

 

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

 

 

 

BOTTOM VIEWPIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TOP VIEW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.05 M C

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-0Ø0.06

.25 M C A B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.50

 

PIN 1 CORNER

 

 

 

 

 

 

 

 

 

 

 

 

(165X)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

-0.06

 

1

2

3

4

5

6

7

8

9

10

11

11

10

9

8

7

6

5

Ø0.50

(165X)

4

3

2

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+0.14

 

15.00±0.10

15.00±0.10

A

1

2

3

4

5

6

7

8

9

10

11

BA

CB

DC

ED

FE

GF

H

G

15.00±0.10

 

 

J

H

 

K

J

 

 

 

LK

ML

NM

PN

RP R

14.00 15.00±0.10

1.00

7.0014.00

1.00

7.00

11

10

9

8

7

6

5

4

3

2

1A

BA

CB

DC

ED

FE

GF

HG

JH

KJ

LK

ML

NM

PN

RP

R

A

0.25 C

A

0.3600.25.3±0C .05

A

B

13.00±0.10

 

 

B

13.00±0.10

 

 

0.53±0.05

1.40 MAX.

0.15 C 1.40 MAX.

0.15 C

C

SEATING PLANE

 

 

SEATING PLANE

 

 

 

 

 

0.36

C

 

 

0.35±0.06

0.35±0.06

 

 

1.00

A

5.00

1.00

 

5.00

 

10.00

 

10.00

B

13.00±0.10

B

13.00±0.10

0.15(4X)

 

0.15(4X)

 

NOTES :

 

SOLDERNOTESPAD TYPE: : NON-SOLDER MASK DEFINED (NSMD)

PACKAGESOLDERW IGHTPAD: 0TYPE.475g: NON-SOLDER MASK DEFINED (NSMD)

JEDEC REFERENCEPACKAGE WEIGHT: MO-216: 0./475gDESIGN 4.6C

PACKAGEJEDECODEREFERENCE: BB0AC : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

51-85180-*A

NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders

Document #: 38-05539 Rev. *E

Page 27 of 28

© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Image 27
Contents 133 MHz 100 MHz Unit FeaturesFunctional Description1 Selection GuideLogic Block Diagram CY7C1357C 512K x Logic Block Diagram CY7C1355C 256K xCY7C1355C Pin Configurations Pin Tqfp PinoutCY7C1357C Pin Configurations Ball BGA Pinout 3 Chip Enables with Jtag Pin Configurations Ball Fbga Pinout 3 Chip enable with Jtag CE2 CLKCE2 Name Description Power supply inputs to the core of the devicePower supply for the I/O circuitry Pin DefinitionsFunctional Overview Single Read AccessesBurst Read Accesses Single Write AccessesInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Function CY7C1355C Sleep ModePartial Truth Table for Read/Write2, 3 Truth Table for Read/Write2, 3,9TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesIdentification Register Definitions 3V TAP AC Test Conditions5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentInstruction Code Description Scan Register SizesIdentification Codes Register Name Bit SizeName CY7C1355C 256K x Bit# Ball ID SignalCY7C1357C 512K x Bit# Ball Id Signal Name Ball BGA Boundary Scan OrderCY7C1355C 256K x Bit# Ball ID Signal Name Ball Fbga Boundary Scan OrderBWD Ambient Range Electrical Characteristics Over the Operating Range13Maximum Ratings Operating Range3V I/O Test Load Capacitance15Thermal Resistance15 AC Test Loads and Waveforms100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 16Write Switching WaveformsCommand Read/Write Waveforms22, 23QA4+1 DA5 QA6 DA7 NOP, Stall and Deselect Cycles22, 23ZZ Mode Timing26 Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change