Cypress CY7C1357C, CY7C1355C Ieee 1149.1 Serial Boundary Scan Jtag, TAP Controller Block Diagram

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CY7C1355C

CY7C1357C

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1355C/CY7C1357C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels.

The CY7C1355C/CY7C1357C contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW(VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alter- nately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the

Test MODE SELECT (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most signif- icant bit (MSB) of any register. (See Tap Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.)

TAP Controller Block Diagram

operation of the device.

TAP Controller State Diagram

1

TEST-LOGIC

 

 

 

 

 

RESET

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

0

RUN-TEST/

1

SELECT

1

SELECT

1

IDLE

 

DR-SCAN

 

IR-SCAN

 

 

 

 

 

 

 

 

0

 

0

 

 

 

 

1

 

1

 

 

 

 

CAPTURE-DR

 

CAPTURE-IR

 

 

 

 

0

 

0

 

 

 

 

SHIFT-DR

0

SHIFT-IR

0

 

 

 

1

 

1

 

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

Selection Circuitry

TDO

EXIT1-DR

1

EXIT1-IR

1

 

 

 

0

 

 

0

 

PAUSE-DR

0

PAUSE-IR

0

 

1

 

 

1

 

0

 

 

0

 

 

EXIT2-DR

 

EXIT2-IR

 

 

1

 

 

1

 

UPDATE-DR

 

UPDATE-IR

 

1

0

 

1

0

 

TCK

TMS

 

TAP CONTROLLER

 

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

The 0/1 next to each state represents the value of TMS at the rising edge of the TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

TAP Registers

Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the Tap Controller Block

Document #: 38-05539 Rev. *E

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Contents 133 MHz 100 MHz Unit FeaturesFunctional Description1 Selection GuideLogic Block Diagram CY7C1357C 512K x Logic Block Diagram CY7C1355C 256K xCY7C1355C Pin Configurations Pin Tqfp PinoutCY7C1357C Pin Configurations Ball BGA Pinout 3 Chip Enables with Jtag CE2 Pin Configurations Ball Fbga Pinout 3 Chip enable with JtagCE2 CLK Name Description Power supply inputs to the core of the devicePower supply for the I/O circuitry Pin DefinitionsFunctional Overview Single Read AccessesBurst Read Accesses Single Write AccessesZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Function CY7C1355C Sleep ModePartial Truth Table for Read/Write2, 3 Truth Table for Read/Write2, 3,9Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller Block DiagramTAP Controller State Diagram TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesIdentification Register Definitions 3V TAP AC Test Conditions5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentInstruction Code Description Scan Register SizesIdentification Codes Register Name Bit SizeName CY7C1355C 256K x Bit# Ball ID SignalCY7C1357C 512K x Bit# Ball Id Signal Name Ball BGA Boundary Scan OrderBWD CY7C1355C 256K x Bit# Ball ID Signal NameBall Fbga Boundary Scan Order Ambient Range Electrical Characteristics Over the Operating Range13Maximum Ratings Operating Range3V I/O Test Load Capacitance15Thermal Resistance15 AC Test Loads and Waveforms100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 16Write Switching WaveformsCommand Read/Write Waveforms22, 23QA4+1 DA5 QA6 DA7 NOP, Stall and Deselect Cycles22, 23ZZ Mode Timing26 Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change