Cypress CY7C1357C, CY7C1355C manual Interleaved Burst Address Table Mode = Floating or VDD

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CY7C1355C

CY7C1357C

precaution, DQs and DQPX are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1355C/CY7C1357C has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write operations without reasserting the address inputs. ADV/LD must be driven LOW in order to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subse- quent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BWX inputs must be driven in each cycle of the burst write, in order to write the correct bytes of data.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

. .

Interleaved Burst Address Table (MODE = Floating or VDD)

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

00

11

10

 

 

 

 

10

11

00

01

 

 

 

 

11

10

01

00

 

 

 

 

Linear Burst Address Table (MODE = GND)

First

Second

Third

Fourth

Address

Address

Address

Address

A1: A0

A1: A0

A1: A0

A1: A0

00

01

10

11

 

 

 

 

01

10

11

00

 

 

 

 

10

11

00

01

 

 

 

 

11

00

01

10

 

 

 

 

ZZ Mode Electrical Characteristics

Parameter

Description

 

 

 

 

 

 

Test Conditions

 

 

 

 

 

Min.

 

 

 

Max.

 

Unit

IDDZZ

Sleep mode standby current

 

 

 

 

ZZ > VDD – 0.2V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

50

 

mA

tZZS

Device operation to ZZ

 

 

 

 

ZZ > VDD – 0.2V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2tCYC

 

ns

tZZREC

ZZ recovery time

 

 

 

 

 

 

ZZ < 0.2V

 

 

 

 

 

 

 

 

 

 

2tCYC

 

 

 

 

 

ns

tZZI

ZZ active to sleep current

 

 

 

 

This parameter is sampled

 

 

 

 

 

 

 

 

 

2tCYC

 

ns

tRZZI

ZZ Inactive to exit sleep current

 

 

 

 

This parameter is sampled

 

 

0

 

 

 

 

 

 

 

ns

Truth Table[2, 3, 4, 5, 6, 7, 8]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Address

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Operation

Used

 

CE

1

CE2

 

CE

3

ZZ

 

ADV/LD

 

 

WE

 

 

BWX

 

OE

CEN

 

CLK

 

DQ

Deselect Cycle

 

None

 

H

X

 

X

L

 

L

 

 

X

 

 

X

 

X

 

 

L

 

L->H

 

Tri-State

Deselect Cycle

 

None

 

X

X

 

H

L

 

L

 

 

X

 

 

X

 

X

 

 

L

 

L->H

 

Tri-State

Deselect Cycle

 

None

 

X

L

 

X

L

 

L

 

 

X

 

 

X

 

X

 

 

L

 

L->H

 

Tri-State

Continue Deselect Cycle

None

 

X

X

 

X

L

 

H

 

 

X

 

 

X

 

X

 

 

L

 

L->H

 

Tri-State

READ Cycle (Begin Burst)

External

 

L

H

 

L

L

 

L

 

 

H

 

 

X

 

L

 

 

L

 

L->H

Data Out (Q)

READ Cycle (Continue Burst)

Next

 

X

X

 

X

L

 

H

 

 

X

 

 

X

 

L

 

 

L

 

L->H

Data Out (Q)

NOP/DUMMY READ (Begin Burst)

External

 

L

H

 

L

L

 

L

 

 

H

 

 

X

 

H

 

 

L

 

L->H

 

Tri-State

DUMMY READ (Continue Burst)

Next

 

X

X

 

X

L

 

H

 

 

X

 

 

X

 

H

 

 

L

 

L->H

 

Tri-State

WRITE Cycle (Begin Burst)

External

 

L

H

 

L

L

 

L

 

 

L

 

 

L

 

X

 

 

L

 

L->H

Data In (D)

WRITE Cycle (Continue Burst)

Next

 

X

X

 

X

L

 

H

 

 

X

 

 

L

 

X

 

 

L

 

L->H

Data In (D)

Notes:

2.X = “Don't Care.” H = Logic HIGH, L = Logic LOW. BWx = L signifies at least one Byte Write Select is active, BWx = Valid signifies that the desired Byte Write Selects are asserted, see Truth Table for details.

3.Write is defined by BWX, and WE. See Truth Table for Read/Write.

4.When a Write cycle is detected, all I/Os are tri-stated, even during Byte Writes.

5.The DQs and DQPX pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.

6.CEN = H, inserts wait states.

7.Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE.

8.OE is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a Read cycle DQs and DQPX = Tri-state when OE is inactive or when the device is deselected, and DQs and DQPX = data when OE is active.

Document #: 38-05539 Rev. *E

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Contents Functional Description1 FeaturesSelection Guide 133 MHz 100 MHz UnitLogic Block Diagram CY7C1357C 512K x Logic Block Diagram CY7C1355C 256K xCY7C1355C Pin Configurations Pin Tqfp PinoutCY7C1357C Pin Configurations Ball BGA Pinout 3 Chip Enables with Jtag Pin Configurations Ball Fbga Pinout 3 Chip enable with Jtag CE2 CLKCE2 Power supply for the I/O circuitry Power supply inputs to the core of the devicePin Definitions Name DescriptionBurst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Partial Truth Table for Read/Write2, 3 Sleep ModeTruth Table for Read/Write2, 3,9 Function CY7C1355CTAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterParameter Description Min Max Unit Clock TAP TimingOutput Times Set-up Times5V TAP AC Test Conditions 3V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsIdentification Codes Scan Register SizesRegister Name Bit Size Instruction Code DescriptionCY7C1357C 512K x Bit# Ball Id Signal Name CY7C1355C 256K x Bit# Ball ID SignalBall BGA Boundary Scan Order NameCY7C1355C 256K x Bit# Ball ID Signal Name Ball Fbga Boundary Scan OrderBWD Maximum Ratings Electrical Characteristics Over the Operating Range13Operating Range Ambient RangeThermal Resistance15 Capacitance15AC Test Loads and Waveforms 3V I/O Test Load100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 16Command Switching WaveformsRead/Write Waveforms22, 23 WriteQA4+1 DA5 QA6 DA7 NOP, Stall and Deselect Cycles22, 23ZZ Mode Timing26 Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change