Cypress CY7C1355C, CY7C1357C manual Functional Overview, Single Read Accesses, Burst Read Accesses

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CY7C1355C

 

 

 

 

CY7C1357C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

Name

I/O

Description

 

 

 

TMS

JTAG serial input

Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature

 

Synchronous

is not being utilized, this pin can be disconnected or connected to VDD. This pin is not

 

 

 

 

available on TQFP packages.

TCK

JTAG

Clock input to the JTAG circuitry. If the JTAG feature is not being utilized, this pin must

 

Clock

be connected to VSS. This pin is not available on TQFP packages.

NC

No Connects. Not internally connected to the die. 18 Mbit, 36 Mbit, 72 Mbit, 144 Mbit, 288

 

 

 

 

Mbit, 576 Mbit and 1G are address expansion pins and are not internally connected to the

 

 

 

 

die.

VSS/DNU

Ground/DNU

This pin can be connected to Ground or should be left floating.

Functional Overview

The CY7C1355C/CY7C1357C is a synchronous flow-through burst SRAM designed specifically to eliminate wait states during Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recog- nized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133-MHz device).

Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device will be latched. The access can either be a Read or Write operation, depending on the status of the Write Enable (WE). BWX can be used to conduct Byte Write operations.

Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self-timed Write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD should be driven LOW once the device has been deselected in order to load a new address for the next operation.

Single Read Accesses

A read access is initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, (3) the Write Enable input signal WE is deasserted HIGH, and 4) ADV/LD is asserted LOW. The address presented to the address inputs is latched into the address register and presented to the memory array and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the output buffers. The data is available within 7.5 ns (133-MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. On the subsequent clock, another operation (Read/Write/Deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, its output will be tri-stated immediately.

Burst Read Accesses

The CY7C1355C/CY7C1357C has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW in order to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and will wrap around when incremented suffi- ciently. A HIGH input on ADV/LD will increment the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence.

Single Write Accesses

Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the Write signal WE is asserted LOW. The address presented to the address bus is loaded into the address register. The write signals are latched into the Control Logic block. The data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQs and DQPX.

On the next clock rise the data presented to DQs and DQPX (or a subset for byte write operations, see Truth Table for details) inputs is latched into the device and the write is complete. Additional accesses (Read/Write/Deselect) can be initiated on this cycle.

The data written during the Write operation is controlled by BWX signals. The CY7C1355C/CY7C1357C provides byte write capability that is described in the Truth Table. Asserting the Write Enable input (WE) with the selected Byte Write Select input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Byte Write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple Byte Write operations.

Because the CY7C1355C/CY7C1357C is a common I/O device, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQs and DQPX inputs. Doing so will tri-state the output drivers. As a safety

Document #: 38-05539 Rev. *E

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Contents Features Functional Description1Selection Guide 133 MHz 100 MHz UnitLogic Block Diagram CY7C1355C 256K x Logic Block Diagram CY7C1357C 512K xPin Configurations Pin Tqfp Pinout CY7C1355CCY7C1357C Pin Configurations Ball BGA Pinout 3 Chip Enables with Jtag CE2 Pin Configurations Ball Fbga Pinout 3 Chip enable with JtagCE2 CLK Power supply inputs to the core of the device Power supply for the I/O circuitryPin Definitions Name DescriptionSingle Read Accesses Burst Read AccessesSingle Write Accesses Functional OverviewZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Sleep Mode Partial Truth Table for Read/Write2, 3Truth Table for Read/Write2, 3,9 Function CY7C1355CIeee 1149.1 Serial Boundary Scan Jtag TAP Controller Block DiagramTAP Controller State Diagram Bypass Register TAP Instruction SetTAP Timing Parameter Description Min Max Unit ClockOutput Times Set-up Times3V TAP AC Test Conditions 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsScan Register Sizes Identification CodesRegister Name Bit Size Instruction Code DescriptionCY7C1355C 256K x Bit# Ball ID Signal CY7C1357C 512K x Bit# Ball Id Signal NameBall BGA Boundary Scan Order NameBWD CY7C1355C 256K x Bit# Ball ID Signal NameBall Fbga Boundary Scan Order Electrical Characteristics Over the Operating Range13 Maximum RatingsOperating Range Ambient RangeCapacitance15 Thermal Resistance15AC Test Loads and Waveforms 3V I/O Test LoadSwitching Characteristics Over the Operating Range 16 100 Parameter Description Unit Min MaxSwitching Waveforms CommandRead/Write Waveforms22, 23 WriteNOP, Stall and Deselect Cycles22, 23 QA4+1 DA5 QA6 DA7ZZ Mode Timing26 Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm 90±0.05Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History