Cypress CY7C1357C manual Features, Functional Description1, Selection Guide, MHz 100 MHz Unit

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CY7C1355C

CY7C1357C

9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL™ Architecture

Features

No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles

Can support up to 133-MHz bus operations with zero wait states

Data is transferred on every clock

Pin compatible and functionally equivalent to ZBT™ devices

Internally self-timed output buffer control to eliminate the need to use OE

Registered inputs for flow-through operation

Byte Write capability

3.3V/2.5V I/O power supply (VDDQ)

Fast clock-to-output times

6.5 ns (for 133-MHz device)

Clock Enable (CEN) pin to enable clock and suspend operation

Synchronous self-timed writes

Asynchronous Output Enable

Available in JEDEC-standard and lead-free 100-Pin TQFP, lead-free and non lead-free 119-Ball BGA package and 165-Ball FBGA package

Three chip enables for simple depth expansion.

Automatic Power-down feature available using ZZ mode or CE deselect

IEEE 1149.1 JTAG-Compatible Boundary Scan

Burst Capability—linear or interleaved burst order

Low standby power

Functional Description[1]

The CY7C1355C/CY7C1357C is a 3.3V, 256K x 36/512K x 18 Synchronous Flow-through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1355C/CY7C1357C is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 6.5 ns (133-MHz device).

Write operations are controlled by the two or four Byte Write Select (BWX) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. In order to avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence.

Selection Guide

 

133 MHz

100 MHz

Unit

Maximum Access Time

6.5

7.5

ns

 

 

 

 

Maximum Operating Current

250

180

mA

 

 

 

 

Maximum CMOS Standby Current

40

40

mA

 

 

 

 

Note:

1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05539 Rev. *E

 

Revised September 14, 2006

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Contents Functional Description1 FeaturesSelection Guide 133 MHz 100 MHz UnitLogic Block Diagram CY7C1357C 512K x Logic Block Diagram CY7C1355C 256K xCY7C1355C Pin Configurations Pin Tqfp PinoutCY7C1357C Pin Configurations Ball BGA Pinout 3 Chip Enables with Jtag CE2 CLK Pin Configurations Ball Fbga Pinout 3 Chip enable with JtagCE2 Power supply for the I/O circuitry Power supply inputs to the core of the devicePin Definitions Name DescriptionBurst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Partial Truth Table for Read/Write2, 3 Sleep ModeTruth Table for Read/Write2, 3,9 Function CY7C1355CTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterParameter Description Min Max Unit Clock TAP TimingOutput Times Set-up Times5V TAP AC Test Conditions 3V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsIdentification Codes Scan Register SizesRegister Name Bit Size Instruction Code DescriptionCY7C1357C 512K x Bit# Ball Id Signal Name CY7C1355C 256K x Bit# Ball ID SignalBall BGA Boundary Scan Order NameBall Fbga Boundary Scan Order CY7C1355C 256K x Bit# Ball ID Signal NameBWD Maximum Ratings Electrical Characteristics Over the Operating Range13Operating Range Ambient RangeThermal Resistance15 Capacitance15AC Test Loads and Waveforms 3V I/O Test Load100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 16Command Switching WaveformsRead/Write Waveforms22, 23 WriteQA4+1 DA5 QA6 DA7 NOP, Stall and Deselect Cycles22, 23ZZ Mode Timing26 Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change