Cypress CY7C1371D manual Features, Selection Guide Functional Description1, MHz 100 MHz Unit

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CY7C1371D

CY7C1373D

18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL™ Architecture

Features

No Bus Latency(NoBL) architecture eliminates dead cycles between write and read cycles

Supports up to 133-MHz bus operations with zero wait states

Data is transferred on every clock

Pin-compatible and functionally equivalent to ZBT™ devices

Internally self-timed output buffer control to eliminate the need to use OE

Registered inputs for flow through operation

Byte Write capability

3.3V/2.5V IO power supply (VDDQ)

Fast clock-to-output times

6.5 ns (for 133-MHz device)

Clock Enable (CEN) pin to enable clock and suspend operation

Synchronous self-timed writes

Asynchronous Output Enable

Available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non-Pb-free 119-Ball BGA and 165-Ball FBGA package.

Three chip enables for simple depth expansion

Automatic Power down feature available using ZZ mode or CE deselect

IEEE 1149.1 JTAG-Compatible Boundary Scan

Burst Capability — linear or interleaved burst order

Low standby power

Selection Guide

Functional Description[1]

The CY7C1371D/CY7C1373D is a 3.3V, 512K x 36/1M x 18 Synchronous flow through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations with no wait state insertion. The CY7C1371D/CY7C1373D is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write-Read transitions.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 6.5 ns (133-MHz device).

Write operations are controlled by the two or four Byte Write Select (BWX) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. To avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence.

 

133 MHz

100 MHz

Unit

Maximum Access Time

6.5

8.5

ns

 

 

 

 

Maximum Operating Current

210

175

mA

 

 

 

 

Maximum CMOS Standby Current

70

70

mA

 

 

 

 

Note:

1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.

Cypress Semiconductor Corporation

• 198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05556 Rev. *F

 

Revised July 09, 2007

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Contents Selection Guide Functional Description1 Features133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1373D 1M x Logic Block Diagram CY7C1371D 512K xCY7C1371D Pin Configurations Pin Tqfp PinoutCY7C1373D Pin Configurations CE2 Pin Configurations Ball Fbga PinoutPin Definitions Burst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Address Operation Used Partial Truth Table for Read/Write 2, 3Function CY7C1371D Function CY7C1373DIeee 1149.1 Serial Boundary Scan Jtag TAP Controller State Diagram TAP Controller Block DiagramTAP Instruction Set Bypass RegisterExtest Output Bus Tri-State TAP TimingSetup Times TAP AC Switching Characteristics Over the Operating Range10Parameter Description Min Max Unit Clock Output Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating ConditionsParameter Description Conditions Min Max Unit Scan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBit # Ball ID Ball BGA Boundary Scan Order 13A10 B10 P10 Maximum Ratings Electrical CharacteristicsOperating Range Ambient RangeThermal Resistance18 Capacitance18AC Test Loads and Waveforms 133 MHz 100 MHz Parameter Description Unit Min Max Switching Characteristics Over the Operating Range23Read/Write Waveforms25, 26 Switching WaveformsRite ReadAddress NOP, Stall and Deselect Cycles25, 26Stall Stall NOPDON’T Care ZZ Mode Timing29Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History Issue Orig. Description of Change Date