Cypress CY7C1371D, CY7C1373D manual Ieee 1149.1 Serial Boundary Scan Jtag

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CY7C1371D

CY7C1373D

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1371D/CY7C1373D incorporates a serial boundary scan test access port (TAP).This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V IO logic levels.

The CY7C1371D/CY7C1373D contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull up resistor. TDO must be left unconnected. Upon power up, the device is up in a reset state which does not interfere with the operation of the device.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See Tap Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.)

TAP Controller State Diagram

TAP Controller Block Diagram

1

0

TEST-LOGIC

RESET

0

RUN-TEST/

IDLE

1

SELECT

1

SELECT

 

DR-SCAN

 

IR-SCAN

 

 

0

 

 

0

 

1

 

 

1

 

 

CAPTURE-DR

 

CAPTURE-IR

 

 

0

 

 

0

 

SHIFT-DR

0

SHIFT-IR

 

 

1

 

 

1

 

EXIT1-DR

1

EXIT1-IR

 

 

 

 

0

 

 

0

 

PAUSE-DR

0

PAUSE-IR

 

 

1

 

 

1

 

0

 

 

0

 

 

EXIT2-DR

 

EXIT2-IR

 

 

1

 

 

1

 

UPDATE-DR

 

UPDATE-IR

 

1

0

 

1

0

1

0

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Selection

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

Selection

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TDI

 

 

 

 

Instruction

Register

 

 

 

 

TDO

 

 

Circuitry

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Circuitry

 

 

 

 

 

 

 

31

30

29

.

.

 

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification

Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

 

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

 

 

 

 

 

 

TCK

TAP CONTROLLER

TMS

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

Test Mode Select (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

At power up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the Tap Controller Block Diagram. Upon power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE

Document #: 38-05556 Rev. *F

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Contents Cypress Semiconductor Corporation FeaturesSelection Guide Functional Description1 133 MHz 100 MHz UnitLogic Block Diagram CY7C1373D 1M x Logic Block Diagram CY7C1371D 512K xCY7C1371D Pin Configurations Pin Tqfp PinoutCY7C1373D Pin Configurations CE2 Pin Configurations Ball Fbga PinoutPin Definitions Functional Overview Single Read AccessesBurst Read Accesses Single Write AccessesZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Function CY7C1373D Partial Truth Table for Read/Write 2, 3Address Operation Used Function CY7C1371DIeee 1149.1 Serial Boundary Scan Jtag TAP Controller State Diagram TAP Controller Block DiagramTAP Instruction Set Bypass RegisterExtest Output Bus Tri-State TAP TimingOutput Times TAP AC Switching Characteristics Over the Operating Range10Setup Times Parameter Description Min Max Unit ClockParameter Description Conditions Min Max Unit TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Register Name Bit Size Identification Register DefinitionsScan Register Sizes Identification CodesBit # Ball ID Ball BGA Boundary Scan Order 13A10 B10 P10 Ambient Range Electrical CharacteristicsMaximum Ratings Operating RangeAC Test Loads and Waveforms Capacitance18Thermal Resistance18 133 MHz 100 MHz Parameter Description Unit Min Max Switching Characteristics Over the Operating Range23Read Switching WaveformsRead/Write Waveforms25, 26 RiteStall NOP NOP, Stall and Deselect Cycles25, 26Address StallDON’T Care ZZ Mode Timing29Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History Issue Orig. Description of Change Date