Cypress CY7C1373D, CY7C1371D manual Functional Overview, Single Read Accesses, Burst Read Accesses

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CY7C1371D

CY7C1373D

Pin Definitions (continued)

Name

IO

Description

 

 

 

TDO

JTAG serial

Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG

 

output

feature is not being used, this pin must be left unconnected. This pin is not available on TQFP

 

Synchronous

packages.

 

 

 

TDI

JTAG serial

Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not

 

input

being used, this pin can be left floating or connected to VDD through a pull up resistor. This pin is

 

Synchronous

not available on TQFP packages.

TMS

JTAG serial

Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not

 

input

being used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP

 

Synchronous

packages.

 

 

 

TCK

JTAG-

Clock input to the JTAG circuitry. If the JTAG feature is not being used, this pin must be

 

Clock

connected to VSS. This pin is not available on TQFP packages.

NC

No Connects. Not internally connected to the die. NC/(36 M, 72 M, 144 M, 288M, 576M, 1G)are

 

 

address expansion pins and are not internally connected to the die.

 

 

 

Functional Overview

The CY7C1371D/CY7C1373D is a synchronous flow through burst SRAM designed specifically to eliminate wait states during Write-Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recog- nized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133-MHz device).

Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device is latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). BWX can be used to conduct byte write operations.

Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD must be driven LOW after the device has been deselected to load a new address for the next operation.

Single Read Accesses

A read access is initiated when these conditions are satisfied at clock rise:

CEN is asserted LOW

CE1, CE2, and CE3 are ALL asserted active

The Write Enable input signal WE is deasserted HIGH

ADV/LD is asserted LOW.

The address presented to the address inputs is latched into the Address Register and presented to the memory array and control logic. The control logic determines that a read access

is in progress and allows the requested data to propagate to the output buffers. The data is available within 6.5 ns (133-MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. On the subsequent clock, another operation (Read/Write/Deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, its output is tri-stated immediately.

Burst Read Accesses

The CY7C1371D/CY7C1373D has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is deter- mined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and wraps around when incremented sufficiently. A HIGH input on ADV/LD increments the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence.

Single Write Accesses

Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the write signal WE is asserted LOW. The address presented to the address bus is loaded into the Address Register. The write signals are latched into the Control Logic block. The data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQs and DQPX.

On the next clock rise the data presented to DQs and DQPX (or a subset for byte write operations, see truth table for

Document #: 38-05556 Rev. *F

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Contents Features Selection Guide Functional Description1133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1371D 512K x Logic Block Diagram CY7C1373D 1M xPin Configurations Pin Tqfp Pinout CY7C1371DCY7C1373D Pin Configurations Pin Configurations Ball Fbga Pinout CE2Pin Definitions Single Read Accesses Burst Read AccessesSingle Write Accesses Functional OverviewZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Partial Truth Table for Read/Write 2, 3 Address Operation UsedFunction CY7C1371D Function CY7C1373DTAP Controller State Diagram TAP Controller Block Diagram Ieee 1149.1 Serial Boundary Scan JtagBypass Register TAP Instruction SetTAP Timing Extest Output Bus Tri-StateTAP AC Switching Characteristics Over the Operating Range10 Setup TimesParameter Description Min Max Unit Clock Output TimesParameter Description Conditions Min Max Unit TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Identification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeBall BGA Boundary Scan Order 13 Bit # Ball IDA10 B10 P10 Electrical Characteristics Maximum RatingsOperating Range Ambient RangeAC Test Loads and Waveforms Capacitance18Thermal Resistance18 Switching Characteristics Over the Operating Range23 133 MHz 100 MHz Parameter Description Unit Min MaxSwitching Waveforms Read/Write Waveforms25, 26Rite ReadNOP, Stall and Deselect Cycles25, 26 AddressStall Stall NOPZZ Mode Timing29 DON’T CareOrdering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Issue Orig. Description of Change Date Document History