Cypress CY7C1373D, CY7C1371D manual Bypass Register, TAP Instruction Set

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CY7C1371D

CY7C1373D

instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and bidirectional balls on the SRAM.

The boundary scan register is loaded with the contents of the RAM IO ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO balls when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the IO ring.

The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table.

TAP Instruction Set

Overview

Eight different instructions are possible with the three bit instruction register. All combinations are listed in the Instruction Codes table. Three of these instructions are listed as RESERVED and must not be used. The other five instruc- tions are described in detail below.

Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. To execute the instruction after it is shifted in, the TAP controller needs to be moved into the Update-IR state.

EXTEST

The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial

access between the TDI and TDO in the shift-DR controller state.

IDCODE

The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO balls and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state.

The IDCODE instruction is loaded into the instruction register upon power up or whenever the TAP controller is supplied a test logic reset state.

SAMPLE Z

The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO balls when the TAP controller is in a Shift-DR state. It also places all SRAM outputs into a High-Z state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register.

The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output undergoes a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible.

To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture setup plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register.

After the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the bound- ary scan register between the TDI and TDO pins.

PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells pri- or to the selection of another boundary scan test operation.

The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in.

BYPASS

When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO balls. The advantage of the BYPASS instruction is that it shortens the

Document #: 38-05556 Rev. *F

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Contents Features Selection Guide Functional Description1133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1371D 512K x Logic Block Diagram CY7C1373D 1M xPin Configurations Pin Tqfp Pinout CY7C1371DCY7C1373D Pin Configurations Pin Configurations Ball Fbga Pinout CE2Pin Definitions Single Read Accesses Burst Read AccessesSingle Write Accesses Functional Overview Interleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GND ZZ Mode Electrical Characteristics Partial Truth Table for Read/Write 2, 3 Address Operation UsedFunction CY7C1371D Function CY7C1373DTAP Controller State Diagram TAP Controller Block Diagram Ieee 1149.1 Serial Boundary Scan JtagBypass Register TAP Instruction SetTAP Timing Extest Output Bus Tri-StateTAP AC Switching Characteristics Over the Operating Range10 Setup TimesParameter Description Min Max Unit Clock Output TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test ConditionsParameter Description Conditions Min Max Unit Identification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeBall BGA Boundary Scan Order 13 Bit # Ball IDA10 B10 P10 Electrical Characteristics Maximum RatingsOperating Range Ambient RangeCapacitance18 Thermal Resistance18AC Test Loads and Waveforms Switching Characteristics Over the Operating Range23 133 MHz 100 MHz Parameter Description Unit Min MaxSwitching Waveforms Read/Write Waveforms25, 26Rite ReadNOP, Stall and Deselect Cycles25, 26 AddressStall Stall NOPZZ Mode Timing29 DON’T CareOrdering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Issue Orig. Description of Change Date Document History
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