Cypress CY7C1370DV25 manual Ieee 1149.1 Serial Boundary Scan Jtag, TAP Controller State Diagram

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CY7C1370DV25

CY7C1372DV25

Function (CY7C1372DV25)

WE

BWb

BWa

Read

H

x

x

Write – No Bytes Written

L

H

H

Write Byte a – (DQa and DQPa)

L

H

L

Write Byte b – (DQb and DQPb)

L

L

H

Write Both Bytes

L

L

L

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1370DV25/CY7C1372DV25 incorporates a serial boundary scan test access port (TAP).This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels.

The CY7C1370DV25/CY7C1372DV25 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device.

TAP Controller State Diagram

Test Mode Select (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See Tap Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant

1 TEST-LOGIC RESET

0

0 RUN-TEST/

IDLE

1

SELECT

1

SELECT

1

 

DR-SCAN

 

IR-SCAN

 

bit (LSB) of any register. (See Tap Controller State Diagram.)

TAP Controller Block Diagram

0

 

0

 

1

 

1

 

CAPTURE-DR

 

CAPTURE-IR

 

0

 

0

 

SHIFT-DR

0

SHIFT-IR

0

1

 

1

 

EXIT1-DR

1

EXIT1-IR

1

 

 

0

 

0

 

PAUSE-DR

0

PAUSE-IR

0

1

 

1

 

0

 

0

 

EXIT2-DR

 

EXIT2-IR

 

1

 

1

 

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

Selection Circuitry

TDO

UPDATE-DR

 

UPDATE-IR

 

1

 

0

 

1

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TCK

TMS

 

TAP CONTROLLER

 

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

Document #: 38-05558 Rev. *D

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Contents Functional Description FeaturesLogic Block Diagram-CY7C1370DV25 512K x Cypress Semiconductor CorporationSelection Guide Logic Block Diagram-CY7C1372DV25 1M x250 MHz 200 MHz 167 MHz Unit Pin Configurations Pin Tqfp Pinout 1M ×Pin Configurations Ball BGA Pinout CY7C1370DV25 512K ×Pin Configurations Ball Fbga Pinout Byte Write Select Inputs, active LOW. Qualified with Pin DefinitionsPin Name Type Pin Description Clock input to the Jtag circuitryIntroduction Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Address Operation Used Partial Write Cycle Description 1, 2, 3Function CY7C1370DV25 TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Registers TAP Instruction SetTAP Timing BypassOutput Times TAP AC Switching Characteristics Over the Operating Range9Parameter Description Min Max Unit Clock Hold Times5V TAP AC Output Load Equivalent TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Scan Register SizesInstruction Code Description Identification CodesBall BGA Boundary Scan Order 12 Bit # Ball IDBall Fbga Boundary Scan Order 12 Operating Range Electrical Characteristics Over the Operating Range15Maximum Ratings Range AmbientAC Test Loads and Waveforms Capacitance17Thermal Resistance17 Package250 200 167 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 22Set-up Times Address A1 A2 Switching WaveformsRead/Write/Timing24, 25 DON’T CareZZ Mode Timing28 NOP,STALL and Deselect Cycles24, 25Ordering Information CY7C1370DV25 CY7C1372DV25 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm ECN No Issue Date Orig. Description of Change Document History