Cypress CY7C1372DV25 manual Switching Characteristics Over the Operating Range 22, Set-up Times

Page 19

CY7C1370DV25

CY7C1372DV25

Switching Characteristics Over the Operating Range [22, 23]

 

 

 

 

 

 

 

 

 

 

–250

–200

–167

 

Parameter

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

tPower[18]

 

VCC (typical) to the first access read or write

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5

 

6

 

ns

FMAX

 

Maximum Operating Frequency

 

250

 

200

 

167

MHz

tCH

 

Clock HIGH

1.7

 

2.0

 

2.2

 

ns

tCL

 

Clock LOW

1.7

 

2.0

 

2.2

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

2.6

 

3.0

 

3.4

ns

tEOV

 

 

 

LOW to Output Valid

 

2.6

 

3.0

 

3.4

ns

OE

tDOH

 

Data Output Hold After CLK Rise

1.0

 

1.3

 

1.3

 

ns

tCHZ

 

Clock to High-Z[19, 20, 21]

 

2.6

 

3.0

 

3.4

ns

tCLZ

 

Clock to Low-Z[19, 20, 21]

1.0

 

1.3

 

1.3

 

ns

tEOHZ

 

 

 

HIGH to Output High-Z[19, 20, 21]

 

2.6

 

3.0

 

3.4

ns

OE

tEOLZ

 

 

 

LOW to Output Low-Z[19, 20, 21]

0

 

0

 

0

 

ns

OE

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

tDS

 

Data Input Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

tCENS

 

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

CEN

tWES

 

 

 

 

 

 

 

x Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

WE,

BW

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Set-up Before CLK Rise

1.2

 

1.4

 

1.5

 

ns

tCES

 

Chip Select Set-up

1.2

 

1.4

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

tDH

 

Data Input Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

tCENH

 

 

 

 

Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

CEN

tWEH

 

 

 

 

 

 

 

x Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

WE,

BW

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold after CLK Rise

0.3

 

0.4

 

0.5

 

ns

tCEH

 

Chip Select Hold After CLK Rise

0.3

 

0.4

 

0.5

 

ns

Notes:

18.This part has a voltage regulator internally; tPower is the time power needs to be supplied above VDD minimum initially, before a Read or Write operation can be initiated.

19.tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

20.At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

21.This parameter is sampled and not 100% tested.

22.Timing reference 1.25V when VDDQ = 2.5V.

23.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

Document #: 38-05558 Rev. *D

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1370DV25 512K x Functional DescriptionSelection Guide Logic Block Diagram-CY7C1372DV25 1M x250 MHz 200 MHz 167 MHz Unit 1M × Pin Configurations Pin Tqfp PinoutCY7C1370DV25 512K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Clock input to the Jtag circuitry Pin DefinitionsPin Name Type Pin Description Byte Write Select Inputs, active LOW. Qualified withIntroduction Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Address Operation Used Partial Write Cycle Description 1, 2, 3Function CY7C1370DV25 TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set TAP RegistersBypass TAP TimingHold Times TAP AC Switching Characteristics Over the Operating Range9Parameter Description Min Max Unit Clock Output TimesScan Register Sizes TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentBit # Ball ID Identification CodesBall BGA Boundary Scan Order 12 Instruction Code DescriptionBall Fbga Boundary Scan Order 12 Range Ambient Electrical Characteristics Over the Operating Range15Maximum Ratings Operating RangePackage Capacitance17Thermal Resistance17 AC Test Loads and Waveforms250 200 167 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 22Set-up Times DON’T Care Switching WaveformsRead/Write/Timing24, 25 Address A1 A2NOP,STALL and Deselect Cycles24, 25 ZZ Mode Timing28Ordering Information CY7C1370DV25 CY7C1372DV25 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change