Cypress CY7C1372DV25, CY7C1370DV25 manual Introduction

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CY7C1370DV25

CY7C1372DV25

Pin Definitions (continued)

Pin Name

I/O Type

Pin Description

 

 

 

VDD

Power Supply

Power supply inputs to the core of the device.

VDDQ

I/O Power

Power supply for the I/O circuitry.

 

Supply

 

VSS

Ground

Ground for the device. Should be connected to ground of the system.

NC

No connects. This pin is not connected to the die.

NC/(36M, 72M,

These pins are not connected. They will be used for expansion to the 36M, 72M, 144M, 288M,

144M, 288M,

 

576M, and 1G densities.

576M, 1G)

 

 

ZZ

Input-

ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep”

 

Asynchronous

condition with data integrity preserved. For normal operation, this pin has to be LOW or left

 

 

floating. ZZ pin has an internal pull-down.

Introduction

Functional Overview

The CY7C1370DV25 and CY7C1372DV25 are synchronous-pipelined Burst NoBL SRAMs designed specifi- cally to eliminate wait states during Write/Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (tCO) is 2.6 ns (250-MHz device).

Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device will be latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). BWX can be used to conduct byte write operations.

Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD should be driven LOW once the device has been deselected in order to load a new address for the next operation.

Single Read Accesses

A read access is initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, (3) the Write Enable input signal WE is deasserted HIGH, and (4) ADV/LD is asserted LOW. The address presented to the address inputs is latched into the Address Register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the rising edge of the next clock the requested data is allowed to propagate through the output register and onto the data bus within 2.6 ns (250-MHz device) provided OE is active LOW. After the first clock of the read access the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in

Document #: 38-05558 Rev. *D

order for the device to drive out the requested data. During the second clock, a subsequent operation (Read/Write/Deselect) can be initiated. Deselecting the device is also pipelined. Therefore, when the SRAM is deselected at clock rise by one of the chip enable signals, its output will three-state following the next clock rise.

Burst Read Accesses

The CY7C1370DV25 and CY7C1372DV25 have an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW in order to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and will wrap around when incremented suffi- ciently. A HIGH input on ADV/LD will increment the internal burst counter regardless of the state of chip enables inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence.

Single Write Accesses

Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the write signal WE is asserted LOW. The address presented is loaded into the Address Register. The write signals are latched into the Control Logic block.

On the subsequent clock rise the data lines are automatically three-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370DV25 and DQa,b/DQPa,b for CY7C1372DV25). In addition, the address for the subse- quent access (Read/Write/Deselect) is latched into the Address Register (provided the appropriate control signals are asserted).

On the next clock rise the data presented to DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370DV25 & DQa,b/DQPa,b for CY7C1372DV25) (or a subset for byte write operations, see Write Cycle Description table for details) inputs is latched into the device and the write is complete.

The data written during the write operation is controlled by BW (BWa,b,c,d for CY7C1370DV25 and BWa,b for CY7C1372DV25)

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1370DV25 512K x Functional DescriptionSelection Guide Logic Block Diagram-CY7C1372DV25 1M x250 MHz 200 MHz 167 MHz Unit 1M × Pin Configurations Pin Tqfp PinoutCY7C1370DV25 512K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Clock input to the Jtag circuitry Pin DefinitionsPin Name Type Pin Description Byte Write Select Inputs, active LOW. Qualified withIntroduction Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Address Operation Used Partial Write Cycle Description 1, 2, 3Function CY7C1370DV25 TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set TAP RegistersBypass TAP TimingHold Times TAP AC Switching Characteristics Over the Operating Range9Parameter Description Min Max Unit Clock Output TimesScan Register Sizes TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions 5V TAP AC Output Load EquivalentBit # Ball ID Identification CodesBall BGA Boundary Scan Order 12 Instruction Code DescriptionBall Fbga Boundary Scan Order 12 Range Ambient Electrical Characteristics Over the Operating Range15Maximum Ratings Operating RangePackage Capacitance17Thermal Resistance17 AC Test Loads and Waveforms250 200 167 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 22Set-up Times DON’T Care Switching WaveformsRead/Write/Timing24, 25 Address A1 A2NOP,STALL and Deselect Cycles24, 25 ZZ Mode Timing28Ordering Information CY7C1370DV25 CY7C1372DV25 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change