Cypress CY7C1372DV25, CY7C1370DV25 manual Maximum Ratings, Operating Range, Range Ambient

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CY7C1370DV25

CY7C1372DV25

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC to Outputs in Tri-State

–0.5V to VDDQ + 0.5V

DC Input Voltage

...................................

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

> 2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

> 200 mA

Operating Range

 

 

 

 

 

Range

 

Ambient

VDD/VDDQ

 

Temperature

 

Commercial

 

0°C to +70°C

2.5V ±5%

 

 

 

 

Industrial

 

–40°C to +85°C

 

 

 

 

 

Electrical Characteristics Over the Operating Range[15, 16]

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

 

2.375

2.625

V

VDDQ

I/O Supply Voltage

for 2.5V I/O

 

2.375

VDD

V

VOH

Output HIGH Voltage

for 2.5V I/O, IOH = 1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 2.5V I/O, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[17]

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[17]

for 2.5V I/O

 

–0.3

0.7

V

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDD, Output Disabled

 

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

 

4.0-ns cycle, 250 MHz

 

350

mA

 

 

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

300

mA

 

 

 

 

6.0-ns cycle, 167 MHz

 

275

mA

 

 

 

 

 

 

 

 

ISB1

Automatic CE

Max. VDD, Device Deselected,

 

4.0-ns cycle, 250 MHz

 

160

mA

 

Power-down

VIN VIH or VIN VIL, f = fMAX =

 

 

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

150

mA

 

Current—TTL Inputs

1/tCYC

 

 

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

140

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

Max. VDD, Device Deselected,

 

All speed grades

 

70

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

 

ISB3

Automatic CE

Max. VDD, Device Deselected,

 

4.0-ns cycle, 250 MHz

 

135

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

130

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

125

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

Max. VDD, Device Deselected,

 

All speed grades

 

80

mA

 

Power-down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

 

Notes:

15.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2).

16.TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

17.Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05558 Rev. *D

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Contents Logic Block Diagram-CY7C1370DV25 512K x FeaturesFunctional Description Cypress Semiconductor Corporation250 MHz 200 MHz 167 MHz Unit Logic Block Diagram-CY7C1372DV25 1M xSelection Guide 1M × Pin Configurations Pin Tqfp PinoutCY7C1370DV25 512K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Pin Name Type Pin Description Pin DefinitionsByte Write Select Inputs, active LOW. Qualified with Clock input to the Jtag circuitryIntroduction ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Function CY7C1370DV25 Partial Write Cycle Description 1, 2, 3Address Operation Used Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Controller Block Diagram TAP Instruction Set TAP RegistersBypass TAP TimingParameter Description Min Max Unit Clock TAP AC Switching Characteristics Over the Operating Range9Output Times Hold Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Output Load Equivalent Scan Register SizesBall BGA Boundary Scan Order 12 Identification CodesInstruction Code Description Bit # Ball IDBall Fbga Boundary Scan Order 12 Maximum Ratings Electrical Characteristics Over the Operating Range15Operating Range Range AmbientThermal Resistance17 Capacitance17AC Test Loads and Waveforms PackageSet-up Times Switching Characteristics Over the Operating Range 22250 200 167 Parameter Description Unit Min Max Read/Write/Timing24, 25 Switching WaveformsAddress A1 A2 DON’T CareNOP,STALL and Deselect Cycles24, 25 ZZ Mode Timing28Ordering Information CY7C1370DV25 CY7C1372DV25 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change