Cypress CY7C1370DV25, CY7C1372DV25 manual Interleaved Burst Address Table Mode = Floating or VDD

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CY7C1370DV25

CY7C1372DV25

signals. The CY7C1370DV25/CY7C1372DV25 provides byte write capability that is described in the Write Cycle Description table. Asserting the Write Enable input (WE) with the selected Byte Write Select (BW) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the write operations. Byte write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple byte write operations.

Because the CY7C1370DV25 and CY7C1372DV25 are common I/O devices, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370DV25 and DQa,b/DQPa,b for CY7C1372DV25) inputs. Doing so will three-state the output drivers. As a safety precaution, DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370DV25 and DQa,b/DQPa,b for CY7C1372DV25) are automatically three-stated during the data portion of a write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1370DV25/CY7C1372DV25 has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four WRITE operations without reasserting the address inputs. ADV/LD must be driven LOW in order to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subsequent clock rise, the chip enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incre- mented. The correct BW (BWa,b,c,d for CY7C1370DV25 and BWa,b for CY7C1372DV25) inputs must be driven in each cycle of the burst write in order to write the correct bytes of data.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

Interleaved Burst Address Table (MODE = Floating or VDD)

First

Second

Third

Fourth

Address

Address

Address

Address

 

 

 

 

A1,A0

A1,A0

A1,A0

A1,A0

 

 

 

 

00

01

10

11

 

 

 

 

01

00

11

10

 

 

 

 

10

11

00

01

 

 

 

 

11

10

01

00

 

 

 

 

Linear Burst Address Table (MODE = GND)

First

Second

Third

Fourth

Address

Address

Address

Address

 

 

 

 

A1,A0

A1,A0

A1,A0

A1,A0

 

 

 

 

00

01

10

11

 

 

 

 

01

10

11

00

 

 

 

 

10

11

00

01

 

 

 

 

11

00

01

10

 

 

 

 

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min.

Max.

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD 0.2V

 

80

mA

tZZS

Device operation to ZZ

ZZ > VDD 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Document #: 38-05558 Rev. *D

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Contents Features Logic Block Diagram-CY7C1370DV25 512K xFunctional Description Cypress Semiconductor Corporation250 MHz 200 MHz 167 MHz Unit Logic Block Diagram-CY7C1372DV25 1M xSelection Guide Pin Configurations Pin Tqfp Pinout 1M ×Pin Configurations Ball BGA Pinout CY7C1370DV25 512K ×Pin Configurations Ball Fbga Pinout Pin Definitions Pin Name Type Pin DescriptionByte Write Select Inputs, active LOW. Qualified with Clock input to the Jtag circuitryIntroduction ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Function CY7C1370DV25 Partial Write Cycle Description 1, 2, 3Address Operation Used Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Controller Block Diagram TAP Registers TAP Instruction SetTAP Timing BypassTAP AC Switching Characteristics Over the Operating Range9 Parameter Description Min Max Unit ClockOutput Times Hold TimesTAP DC Electrical Characteristics And Operating Conditions 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Scan Register SizesIdentification Codes Ball BGA Boundary Scan Order 12Instruction Code Description Bit # Ball IDBall Fbga Boundary Scan Order 12 Electrical Characteristics Over the Operating Range15 Maximum RatingsOperating Range Range AmbientCapacitance17 Thermal Resistance17AC Test Loads and Waveforms PackageSet-up Times Switching Characteristics Over the Operating Range 22250 200 167 Parameter Description Unit Min Max Switching Waveforms Read/Write/Timing24, 25Address A1 A2 DON’T CareZZ Mode Timing28 NOP,STALL and Deselect Cycles24, 25Ordering Information CY7C1370DV25 CY7C1372DV25 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Ball Fbga 13 x 15 x 1.4 mm ECN No Issue Date Orig. Description of Change Document History