Cypress CY7C1447AV33, CY7C1441AV33, CY7C1443AV33 manual Capacitance, Thermal Resistance

CY7C1441AV33

CY7C1443AV33,CY7C1447AV33

Capacitance

Parameter[17]	Description	Test Conditions
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,
		VDD = 3.3V
CCLK	Clock Input Capacitance
		VDDQ = 2.5V
CIO	Input/Output Capacitance

100 TQFP	165 FBGA	209 FBGA	Unit
Max.	Max.	Max.
6.5	7	5	pF
3	7	5	pF
5.5	6	7	pF

Thermal Resistance

Parameter[17]	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	25.21	20.8	25.31	°C/W
	(Junction to Ambient)	test methods and procedures for
		measuring thermal impedance,
ΘJC	Thermal Resistance		2.28	3.2	4.48	°C/W
		per EIA/JESD51.
	(Junction to Case)
		Figure 2. AC Test Loads and Waveforms

3.3V IO Test Load

OUTPUT

3.3V

R = 317Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

≤ 1 ns

VT = 1.5V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VT = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Note

17. Tested initially and after any design or process change that may affect these parameters

Document #: 38-05357 Rev. *G Page 20 of 31

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