Cypress CY7C1447AV33, CY7C1441AV33 manual Identification Register Definitions, Scan Register Sizes

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CY7C1441AV33

CY7C1443AV33,CY7C1447AV33

Identification Register Definitions

Instruction Field

CY7C1441AV33

CY7C1443AV33

CY7C1447AV33

Description

(1M x 36)

(2M x 18)

(512K x 72)

 

 

Revision Number (31:29)

000

000

000

Describes the version number.

 

 

 

 

 

Device Depth (28:24)

01011

01011

01011

Reserved for Internal Use

 

 

 

 

 

Architecture/Memory

000001

000001

000001

Defines memory type and architecture

Type(23:18)[12]

 

 

 

 

Bus Width/Density(17:12)

100111

010111

110111

Defines width and density

 

 

 

 

 

Cypress JEDEC ID Code (11:1)

00000110100

00000110100

00000110100

Allows unique identification of SRAM

 

 

 

 

vendor.

ID Register Presence Indicator (0)

1

1

1

Indicates the presence of an ID

 

 

 

 

register.

Scan Register Sizes

Register Name

Bit Size (x36)

Bit Size (x18)

Bit Size (x18)

Instruction

3

3

3

 

 

 

 

Bypass

1

1

1

 

 

 

 

ID

32

32

32

 

 

 

 

Boundary Scan Order (165-ball FBGA package)

89

89

-

 

 

 

 

Boundary Scan Order (209-ball FBGA package)

-

-

138

 

 

 

 

Identification Codes

Instruction

Code

Description

EXTEST

000

Captures IO ring contents.

 

 

 

IDCODE

001

Loads the ID register with the vendor ID code and places the register between TDI and

 

 

TDO. This operation does not affect SRAM operations.

SAMPLE Z

010

Captures IO ring contents. Places the boundary scan register between TDI and TDO.

 

 

Forces all SRAM output drivers to a High-Z state.

RESERVED

011

Do Not Use: This instruction is reserved for future use.

 

 

 

SAMPLE/PRELOAD

100

Captures IO ring contents. Places the boundary scan register between TDI and TDO.

 

 

Does not affect SRAM operation.

RESERVED

101

Do Not Use: This instruction is reserved for future use.

 

 

 

RESERVED

110

Do Not Use: This instruction is reserved for future use.

 

 

 

BYPASS

111

Places the bypass register between TDI and TDO. This operation does not affect SRAM

 

 

operations.

Note

12. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.

Document #: 38-05357 Rev. *G

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Contents Selection Guide Functional Description FeaturesDescription 133 MHz 100 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1443AV33 2Mx Logic Block Diagram CY7C1441AV33 1M xBWE Enable CE1 Register CE2 CE3 Logic Block Diagram CY7C1447AV33 512K xCY7C1443AV33 2M x Pin ConfigurationsCY7C1441AV33 BWE Adsc ADV TDI TDO ModeAdsp DQP CDQ G DQ G DQ BDQ B DQP G DQP C DQP DQ CByte Write Select Inputs, Active LOW. Qualified with Pin DefinitionsName Description Power Supply for the IO Circuitry Power Supply Inputs to the Core of the DeviceGround for the Core of the Device Ground for the IO CircuitryLinear Burst Address Table Interleaved Burst Address Table Mode = Floating or VDDFunctional Overview Truth Table ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Cycle DescriptionTruth Table for Read/Write Partial Truth Table for Read/WriteFunction CY7C1441AV33 2 Function CY7C1443AV33Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramInstruction Register TAP Instruction SetExtest TAP TimingSetup Times TAP AC Switching CharacteristicsParameter Description Min Max Unit Clock Hold Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Parameter Description Conditions Min Max UnitScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBit # Ball ID Ball Fbga Boundary Scan Order13,14CY7C1441AV33 1M x 36, CY7C1443AV33 2M x Bit # Ball ID DC Electrical Characteristics Over the Operating Range Electrical Characteristics Over the Operating Range15Maximum Ratings Operating RangeThermal Resistance CapacitanceOutput Times Switching Characteristics100 Unit Parameter Min Max Adsp Adsc Timing DiagramsData Out Q High-Z QA1 ADV suspends burstWrite Cycle Timing24 Read/Write Cycle Timing24, 26 ZZ Mode Timing28 Ordering Information Pin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x1.76 mm SYT Issue Date Orig. Description of ChangeCJM VKN/AESA RXUVKN