Cypress CY7C1447AV33 Power Supply Inputs to the Core of the Device, Ground for the IO Circuitry

Page 8

 

 

 

 

CY7C1441AV33

 

 

 

 

CY7C1443AV33,CY7C1447AV33

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

 

 

 

Name

 

 

IO

Description

 

 

DQs

 

 

IO-

Bidirectional Data IO lines. As inputs, they feed into an on-chip data register

 

 

Synchronous

that is triggered by the rising edge of CLK. As outputs, they deliver the data

 

 

 

 

 

contained in the memory location specified by the addresses presented during

 

 

 

 

 

the previous clock rise of the read cycle. The direction of the pins is controlled

 

 

 

 

 

by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH,

 

 

 

 

 

DQs and DQPX are placed in a tri-state condition.The outputs are automati-

 

 

 

 

 

cally tri-stated during the data portion of a write sequence, during the first clock

 

 

 

 

 

when emerging from a deselected state, and when the device is deselected,

 

 

 

 

 

regardless of the state of OE.

 

DQPX

 

 

IO-

Bidirectional Data Parity IO Lines. Functionally, these signals are identical

 

 

 

Synchronous

to DQs. During write sequences, DQPx is controlled by BW[A:H] correspond-

 

 

 

 

 

ingly.

 

MODE

Input-Static

Selects Burst Order. When tied to GND selects linear burst sequence. When

 

 

 

 

 

 

tied to VDD or left floating selects interleaved burst sequence. This is a strap

 

 

 

 

 

pin and should remain static during device operation. Mode Pin has an internal

 

 

 

 

 

pull up.

 

VDD

Power Supply

Power Supply Inputs to the Core of the Device.

 

 

VDDQ

IO Power Supply

Power Supply for the IO Circuitry.

 

 

VSS

Ground

Ground for the Core of the Device.

 

 

VSSQ

IO Ground

Ground for the IO Circuitry.

 

 

TDO

JTAG serial output

Serial Data-Out to the JTAG Circuit. Delivers data on the negative edge of

 

 

 

Synchronous

TCK. If the JTAG feature is not being utilized, this pin should be left uncon-

 

 

 

 

 

nected. This pin is not available on TQFP packages.

 

TDI

JTAG serial

Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If

 

 

 

 

 

input

the JTAG feature is not being utilized, this pin can be left floating or connected

 

 

Synchronous

to VDD through a pull up resistor. This pin is not available on TQFP packages.

 

TMS

JTAG serial

Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If

 

 

 

 

 

input

the JTAG feature is not being utilized, this pin can be disconnected or

 

 

Synchronous

connected to VDD. This pin is not available on TQFP packages.

 

TCK

JTAG-Clock

Clock Input to the JTAG Circuitry. If the JTAG feature is not being utilized,

 

 

 

 

 

 

this pin must be connected to VSS. This pin is not available on TQFP

 

 

 

 

 

packages.

 

NC

-

No Connects. Not internally connected to the die. 72M, 144M and 288M are

 

 

 

 

 

 

address expansion pins are not internally connected to the die.

 

NC/72M, NC/144M,

-

No Connects. Not internally connected to the die. NC/72M, NC/144M,

 

 

NC/288M, NC/576M

 

 

 

NC/288M, NC/576M and NC/1G are address expansion pins are not internally

 

NC/1G

 

 

 

connected to the die.

 

Document #: 38-05357 Rev. *G

Page 8 of 31

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Contents Features Selection Guide Functional DescriptionDescription 133 MHz 100 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1441AV33 1M x Logic Block Diagram CY7C1443AV33 2MxLogic Block Diagram CY7C1447AV33 512K x BWE Enable CE1 Register CE2 CE3CY7C1443AV33 2M x Pin ConfigurationsCY7C1441AV33 TDI TDO Mode BWE Adsc ADVAdsp DQP CDQ G DQ B DQ GDQ B DQP G DQP C DQP DQ CByte Write Select Inputs, Active LOW. Qualified with Pin DefinitionsName Description Power Supply Inputs to the Core of the Device Power Supply for the IO CircuitryGround for the Core of the Device Ground for the IO CircuitryLinear Burst Address Table Interleaved Burst Address Table Mode = Floating or VDDFunctional Overview ZZ Mode Electrical Characteristics Truth TableParameter Description Test Conditions Min Max Unit Cycle DescriptionPartial Truth Table for Read/Write Truth Table for Read/WriteFunction CY7C1441AV33 2 Function CY7C1443AV33TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set Instruction RegisterTAP Timing ExtestTAP AC Switching Characteristics Setup TimesParameter Description Min Max Unit Clock Hold TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions Parameter Description Conditions Min Max UnitIdentification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeBit # Ball ID Ball Fbga Boundary Scan Order13,14CY7C1441AV33 1M x 36, CY7C1443AV33 2M x Bit # Ball ID Electrical Characteristics Over the Operating Range15 DC Electrical Characteristics Over the Operating RangeMaximum Ratings Operating RangeCapacitance Thermal ResistanceOutput Times Switching Characteristics100 Unit Parameter Min Max Timing Diagrams Adsp AdscData Out Q High-Z QA1 ADV suspends burstWrite Cycle Timing24 Read/Write Cycle Timing24, 26 ZZ Mode Timing28 Ordering Information Package Diagrams Pin Tqfp 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x1.76 mm SYT Issue Date Orig. Description of ChangeCJM VKN/AESA RXUVKN