Cypress CY7C1443AV33 ZZ Mode Electrical Characteristics, Truth Table, Cycle Description, Used

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CY7C1441AV33

CY7C1443AV33,CY7C1447AV33

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min.

Max.

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD – 0.2V

 

100

mA

tZZS

Device operation to ZZ

ZZ > VDD – 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Truth Table

tThe truth table for CY7C1441AV33/CY7C1443AV33/CY7C1447AV33 follows.[2, 3, 4, 5, 6]

 

ADDRESS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cycle Description

CE1

CE2

 

CE3

ZZ

 

ADSP

 

ADSC

 

 

ADV

 

 

WRITE

 

OE

CLK

DQ

Used

 

 

 

 

 

 

 

 

 

Deselected Cycle, Power down

None

 

H

X

 

X

L

 

X

 

L

 

 

X

 

 

X

 

X

L-H

Tri-State

Deselected Cycle, Power down

None

 

L

L

 

X

L

 

L

 

X

 

 

X

 

 

X

 

X

L-H

Tri-State

Deselected Cycle, Power down

None

 

L

X

 

H

L

 

L

 

X

 

 

X

 

 

X

 

X

L-H

Tri-State

Deselected Cycle, Power down

None

 

L

L

 

X

L

 

H

 

L

 

 

X

 

 

X

 

X

L-H

Tri-State

Deselected Cycle, Power down

None

 

X

X

 

X

L

 

H

 

L

 

 

X

 

 

X

 

X

L-H

Tri-State

Sleep Mode, Power down

None

 

X

X

 

X

H

 

X

 

X

 

 

X

 

 

X

 

X

X

Tri-State

Read Cycle, Begin Burst

External

 

L

H

 

L

L

 

L

 

X

 

 

X

 

 

X

 

L

L-H

Q

Read Cycle, Begin Burst

External

 

L

H

 

L

L

 

L

 

X

 

 

X

 

 

X

 

H

L-H

Tri-State

Write Cycle, Begin Burst

External

 

L

H

 

L

L

 

H

 

L

 

 

X

 

 

L

 

X

L-H

D

Read Cycle, Begin Burst

External

 

L

H

 

L

L

 

H

 

L

 

 

X

 

 

H

 

L

L-H

Q

Read Cycle, Begin Burst

External

 

L

H

 

L

L

 

H

 

L

 

 

X

 

 

H

 

H

L-H

Tri-State

Read Cycle, Continue Burst

Next

 

X

X

 

X

L

 

H

 

H

 

 

L

 

 

H

 

L

L-H

Q

Read Cycle, Continue Burst

Next

 

X

X

 

X

L

 

H

 

H

 

 

L

 

 

H

 

H

L-H

Tri-State

Read Cycle, Continue Burst

Next

 

H

X

 

X

L

 

X

 

H

 

 

L

 

 

H

 

L

L-H

Q

Read Cycle, Continue Burst

Next

 

H

X

 

X

L

 

X

 

H

 

 

L

 

 

H

 

H

L-H

Tri-State

Write Cycle, Continue Burst

Next

 

X

X

 

X

L

 

H

 

H

 

 

L

 

 

L

 

X

L-H

D

Write Cycle, Continue Burst

Next

 

H

X

 

X

L

 

X

 

H

 

 

L

 

 

L

 

X

L-H

D

Read Cycle, Suspend Burst

Current

 

X

X

 

X

L

 

H

 

H

 

 

H

 

 

H

 

L

L-H

Q

Read Cycle, Suspend Burst

Current

 

X

X

 

X

L

 

H

 

H

 

 

H

 

 

H

 

H

L-H

Tri-State

Read Cycle, Suspend Burst

Current

 

H

X

 

X

L

 

X

 

H

 

 

H

 

 

H

 

L

L-H

Q

Read Cycle, Suspend Burst

Current

 

H

X

 

X

L

 

X

 

H

 

 

H

 

 

H

 

H

L-H

Tri-State

Write Cycle, Suspend Burst

Current

 

X

X

 

X

L

 

H

 

H

 

 

H

 

 

L

 

X

L-H

D

Write Cycle, Suspend Burst

Current

 

H

X

 

X

L

 

X

 

H

 

 

H

 

 

L

 

X

L-H

D

Notes

2.X = “Don't Care.” H = Logic HIGH, L = Logic LOW.

3.WRITE = L when any one or more Byte Write enable signals and BWE = L or GW = L. WRITE = H when all Byte write enable signals, BWE, GW = H.

4.The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.

5.The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to tri-state. OE is a don't care for the remainder of the write cycle.

6.OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).

Document #: 38-05357 Rev. *G

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Contents Description 133 MHz 100 MHz Unit FeaturesSelection Guide Functional Description Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1441AV33 1M x Logic Block Diagram CY7C1443AV33 2MxLogic Block Diagram CY7C1447AV33 512K x BWE Enable CE1 Register CE2 CE3CY7C1441AV33 Pin ConfigurationsCY7C1443AV33 2M x Adsp TDI TDO ModeBWE Adsc ADV DQP CDQ B DQP G DQP C DQ G DQ BDQ G DQP DQ CName Description Pin DefinitionsByte Write Select Inputs, Active LOW. Qualified with Ground for the Core of the Device Power Supply Inputs to the Core of the DevicePower Supply for the IO Circuitry Ground for the IO CircuitryFunctional Overview Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Parameter Description Test Conditions Min Max Unit ZZ Mode Electrical CharacteristicsTruth Table Cycle DescriptionFunction CY7C1441AV33 2 Partial Truth Table for Read/WriteTruth Table for Read/Write Function CY7C1443AV33TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set Instruction RegisterTAP Timing ExtestParameter Description Min Max Unit Clock TAP AC Switching CharacteristicsSetup Times Hold Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Conditions Min Max UnitIdentification Codes Identification Register DefinitionsScan Register Sizes Register Name Bit SizeCY7C1441AV33 1M x 36, CY7C1443AV33 2M x Bit # Ball ID Ball Fbga Boundary Scan Order13,14Bit # Ball ID Maximum Ratings Electrical Characteristics Over the Operating Range15DC Electrical Characteristics Over the Operating Range Operating RangeCapacitance Thermal Resistance100 Unit Parameter Min Max Switching CharacteristicsOutput Times Data Out Q High-Z QA1 Timing DiagramsAdsp Adsc ADV suspends burstWrite Cycle Timing24 Read/Write Cycle Timing24, 26 ZZ Mode Timing28 Ordering Information Package Diagrams Pin Tqfp 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x1.76 mm CJM Issue Date Orig. Description of ChangeSYT VKN RXUVKN/AESA