Cypress CY7C1266V18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1266V18, CY7C1277V18

CY7C1268V18, CY7C1270V18

36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)

Features

36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)

300 MHz to 400 MHz clock for high bandwidth

2-Word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces

(data transferred at 800 MHz) at 400 MHz

Read latency of 2.5 clock cycles

Two input clocks (K and K) for precise DDR timing SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high speed systems

Data valid pin (QVLD) to indicate valid data on the output

Synchronous internally self-timed writes

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD[1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-ball FBGA package (15 x 17 x 1.4 mm)

Offered in both in Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1266V18, CY7C1277V18, CY7C1268V18, and CY7C1270V18 are 1.8V Synchronous Pipelined SRAMs equipped with DDR-II+ architecture. The DDR-II+ consists of an SRAM core with advanced synchronous peripheral circuitry. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of both K and K. Each address location is associated with two 8-bit words (CY7C1266V18), 9-bit words (CY7C1277V18), 18-bit words (CY7C1268V18), or 36-bit words (CY7C1270V18), that burst sequentially into or out of the device.

Asynchronous inputs include output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs, D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need to capture data separately from each individual DDR SRAM in the system design.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

With Read Cycle Latency of 2.5 cycles:

CY7C1266V18 – 4M x 8

CY7C1277V18 – 4M x 9

CY7C1268V18 – 2M x 18

CY7C1270V18 – 1M x 36

Selection Guide

Description

400 MHz

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

400

375

333

300

MHz

 

 

 

 

 

 

Maximum Operating Current

1280

1210

1080

1000

mA

 

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-06347 Rev. *D

 

Revised March 11, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1277V18 Logic Block Diagram CY7C1266V18Logic Block Diagram CY7C1270V18 Logic Block Diagram CY7C1268V18CY7C1266V18 4M x Pin ConfigurationsCY7C1277V18 4M x TMS TDICY7C1270V18 1M x CY7C1268V18 2M xQvld BWSPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When Negative Input Clock InputPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Application Example Delay Lock Loop DLLTruth Table OperationComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceInto the device Write cycle description table for CY7C1270V18 follows.2Written into the device. D 359 remains unaltered Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows.9 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramParameter Description Test Conditions Min Max Unit GND ≤ VI ≤ VDDTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II+ SramPower Up Waveforms DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance20 Capacitance20AC Test Loads and Waveforms Parameter Description Test Conditions Max UnitParameter Min Max Switching CharacteristicsHigh LOWRead/Write/Deselect Sequence29 Switching WaveformsNOP Ordering Information 333 Ball Fbga 15 x 17 x 1.40 mm Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeNXR VKN