Cypress CY7C1277V18 manual TDO for Jtag, TCK Pin for Jtag, TDI Pin for Jtag, TMS Pin for Jtag

Page 7

 

 

 

 

 

 

CY7C1266V18, CY7C1277V18

 

 

 

 

 

 

CY7C1268V18, CY7C1270V18

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

 

 

Pin Name

IO

 

 

Pin Description

 

 

 

 

 

 

 

 

ZQ

Input

Output Impedance Matching Input. This input is used to tune the device outputs to the system

 

 

 

 

 

 

data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a

 

 

 

 

 

resistor connected between ZQ and ground. Alternatively, this pin can be connected directly to

 

 

 

 

 

VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to

 

 

 

 

 

GND or left unconnected.

 

 

 

 

 

 

 

 

 

 

Input

DLL Turn Off, Active LOW. Connecting this pin to ground turns off the DLL inside the device.

 

 

DOFF

 

 

 

 

The timing in the DLL turned off operation is different from that listed in this data sheet. For

 

 

 

 

 

normal operation, this pin can be connected to a pull up through a 10 Kohm or less pull up

 

 

 

 

 

resistor. The device behaves in DDR-I mode when the DLL is turned off. In this mode, the device

 

 

 

 

 

can be operated at a frequency of up to 167 MHz with DDR-I timing.

 

 

 

 

 

 

 

TDO

Output

TDO for JTAG.

 

 

 

 

 

 

 

 

TCK

Input

TCK Pin for JTAG.

 

 

 

 

 

 

 

 

TDI

Input

TDI Pin for JTAG.

 

 

 

 

 

 

 

 

TMS

Input

TMS Pin for JTAG.

 

 

 

 

 

 

 

 

NC

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/72M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/144M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

NC/288M

N/A

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

 

 

VREF

Input-

Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs,

 

 

 

 

 

Reference

and AC measurement points.

 

 

 

 

 

 

 

VDD

Power Supply

Power Supply Inputs to the Core of the Device.

 

 

 

VSS

Ground

Ground for the Device.

 

 

 

VDDQ

Power Supply

Power Supply Inputs for the Outputs of the Device.

 

 

Document Number: 001-06347 Rev. *D

Page 7 of 27

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Contents Selection Guide FeaturesConfigurations Functional DescriptionLogic Block Diagram CY7C1277V18 Logic Block Diagram CY7C1266V18Logic Block Diagram CY7C1270V18 Logic Block Diagram CY7C1268V18TMS TDI Pin ConfigurationsCY7C1266V18 4M x CY7C1277V18 4M xBWS CY7C1268V18 2M xCY7C1270V18 1M x QvldNegative Input Clock Input Pin DefinitionsPin Name Pin Description Synchronous Read/Write Input. WhenTCK Pin for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TDO for JtagFunctional Overview Operation Delay Lock Loop DLLApplication Example Truth TableDuring the data portion of a write sequence Write Cycle DescriptionsComments Remains unalteredInto the device. D 80 and D 3518 remain unaltered Write cycle description table for CY7C1270V18 follows.2Into the device Written into the device. D 359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows.9 TAP Controller State DiagramGND ≤ VI ≤ VDD TAP Controller Block DiagramTAP Electrical Characteristics Parameter Description Test Conditions Min Max UnitTAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderDLL Constraints Power Up Sequence in DDR-II+ SramPower Up Sequence Power Up WaveformsOperating Range Electrical CharacteristicsDC Electrical Characteristics Maximum RatingsParameter Description Test Conditions Max Unit Capacitance20Thermal Resistance20 AC Test Loads and WaveformsLOW Switching CharacteristicsParameter Min Max HighRead/Write/Deselect Sequence29 Switching WaveformsNOP Ordering Information 333 Ball Fbga 15 x 17 x 1.40 mm Package DiagramVKN ECN No Issue Date Orig. Description of ChangeDocument History NXR