Cypress CY7C1266V18, CY7C1270V18 Application Example, Truth Table, Delay Lock Loop DLL, Operation

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CY7C1266V18, CY7C1277V18 CY7C1268V18, CY7C1270V18

Delay Lock Loop (DLL)

These chips use a DLL that is designed to function between 120 MHz and the specified maximum clock frequency. The DLL may be disabled by applying ground to the DOFF pin. When the DLL is turned off, the device behaves in DDR-I mode (with 1.0 cycle latency and a longer access time). For more information, refer to

the application note, DLL Considerations in QDRII/DDRII/QDRII+/DDRII+. The DLL can also be reset by slowing or stopping the input clocks K and K for a minimum of 30 ns. However, it is not necessary for the DLL to be reset to lock to the frequency you want. During power up, when the DOFF is tied HIGH, the DLL is locked after 2048 cycles of stable clock.

Application Example

Figure 1 shows two DDR-II+ used in an application.

Figure 1. Application Example

 

 

 

SRAM#1

 

ZQ

 

 

SRAM#2

 

ZQ

 

 

 

DQ

CQ/CQ

R = 250ohms

DQ

CQ/CQ

R = 250ohms

 

 

 

 

 

 

 

 

A

LD

R/W

K

K

 

A

LD

R/W

K

K

 

 

 

DQ

 

 

 

 

 

 

 

 

 

 

 

BUS

 

Addresses

 

 

 

 

 

 

 

 

 

 

 

MASTER

Cycle Start

 

 

 

 

 

 

 

 

 

 

 

(CPU or ASIC)

R/W

 

 

 

 

 

 

 

 

 

 

 

 

Source CLK

 

 

 

 

 

 

 

 

 

 

 

 

Source CLK

 

 

 

 

 

 

 

 

 

 

 

Echo Clock1/Echo Clock1

 

 

 

 

 

 

 

 

 

 

 

Echo Clock2/Echo Clock2

 

 

 

 

 

 

 

 

 

 

 

Truth Table

The truth table for CY7C1266V18, CY7C1277V18, CY7C1268V18, and CY7C1270V18 follows.[2, 3, 4, 5, 6, 7]

Operation

K

 

LD

R/W

 

DQ

DQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Write Cycle:

L-H

 

L

L

D(A) at K(t + 1)

D(A + 1) at

 

 

K(t + 1)

Load address; wait one cycle; input write data on consecutive

 

 

 

 

 

 

 

 

 

 

 

 

 

K and K rising edges.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read Cycle: (2.5 cycle Latency)

L-H

 

L

H

Q(A) at

 

 

Q(A + 1) at K(t + 3)

K(t + 2)

Load address; wait two and half cycle; read data on consec-

 

 

 

 

 

 

 

 

 

 

 

 

 

utive K and K rising edges.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOP: No Operation

L-H

 

H

X

High-Z

High-Z

 

 

 

 

 

 

 

Standby: Clock Stopped

Stopped

 

X

X

Previous State

Previous State

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

2.X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.

3.Device powers up deselected with the outputs in a tri-state condition.

4.“A” represents address location latched by the devices when transaction was initiated. A + 1 represents the address sequence in the burst.

5.“t” represents the cycle at which a read/write operation is started. t + 1, t + 2, and t + 3 are the first, second, and third clock cycles succeeding the “t” clock cycle.

6.Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges.

7.Cypress recommends that K = K = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically.

Document Number: 001-06347 Rev. *D

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1277V18 Logic Block Diagram CY7C1266V18Logic Block Diagram CY7C1270V18 Logic Block Diagram CY7C1268V18CY7C1266V18 4M x Pin ConfigurationsCY7C1277V18 4M x TMS TDICY7C1270V18 1M x CY7C1268V18 2M xQvld BWSPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When Negative Input Clock InputPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Application Example Delay Lock Loop DLLTruth Table OperationComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceInto the device Write cycle description table for CY7C1270V18 follows.2Written into the device. D 359 remains unaltered Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows.9 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramParameter Description Test Conditions Min Max Unit GND ≤ VI ≤ VDDTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II+ SramPower Up Waveforms DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance20 Capacitance20AC Test Loads and Waveforms Parameter Description Test Conditions Max UnitParameter Min Max Switching CharacteristicsHigh LOWSwitching Waveforms Read/Write/Deselect Sequence29NOP Ordering Information 333 Ball Fbga 15 x 17 x 1.40 mm Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeNXR VKN