Cypress CY7C1266V18, CY7C1270V18 Capacitance20, Thermal Resistance20, AC Test Loads and Waveforms

Page 21

CY7C1266V18, CY7C1277V18

CY7C1268V18, CY7C1270V18

Capacitance[20]

Parameter

Description

Test Conditions

Max

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz,

5

pF

 

 

VDD = 1.8V

 

 

CCLK

Clock Input Capacitance

4

pF

VDDQ = 1.5V

CO

Output Capacitance

 

5

pF

Thermal Resistance[20]

Parameter

Description

Test Conditions

165 FBGA

Unit

Package

 

 

 

 

ΘJA

Thermal Resistance

Test conditions follow standard test methods and

16.25

°C/W

 

(Junction to Ambient)

procedures for measuring thermal impedance, per

 

 

 

 

EIA/JESD51.

 

 

ΘJC

Thermal Resistance

2.91

°C/W

 

 

(Junction to Case)

 

 

 

 

 

 

 

 

AC Test Loads and Waveforms

Figure 4. AC Test Loads and Waveforms

VREF = 0.75V

VREF

 

 

 

 

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

Z0 = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

Under

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

 

 

 

 

 

 

 

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREF

 

 

 

 

 

 

0.75V

 

 

 

 

 

R = 50Ω

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ALL INPUT PULSES[21]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Device

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5 pF 0.25V

 

 

 

0.75V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Under

ZQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Slew Rate = 2 V/ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Test

 

 

 

 

 

 

RQ =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

250Ω

 

 

 

 

 

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

(b)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

20.Tested initially and after any design or process change that may affect these parameters.

21.Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, VREF = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document Number: 001-06347 Rev. *D

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1277V18 Logic Block Diagram CY7C1266V18Logic Block Diagram CY7C1270V18 Logic Block Diagram CY7C1268V18CY7C1266V18 4M x Pin ConfigurationsCY7C1277V18 4M x TMS TDICY7C1270V18 1M x CY7C1268V18 2M xQvld BWSPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When Negative Input Clock InputPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Application Example Delay Lock Loop DLLTruth Table OperationComments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceInto the device Write cycle description table for CY7C1270V18 follows.2Written into the device. D 359 remains unaltered Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows.9 TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramParameter Description Test Conditions Min Max Unit GND ≤ VI ≤ VDDTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II+ SramPower Up Waveforms DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeThermal Resistance20 Capacitance20AC Test Loads and Waveforms Parameter Description Test Conditions Max UnitParameter Min Max Switching CharacteristicsHigh LOWSwitching Waveforms Read/Write/Deselect Sequence29NOP Ordering Information 333 Ball Fbga 15 x 17 x 1.40 mm Package DiagramDocument History ECN No Issue Date Orig. Description of ChangeNXR VKN