Cypress CY7C1270V18, CY7C1266V18, CY7C1268V18, CY7C1277V18 Ieee 1149.1 Serial Boundary Scan Jtag

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CY7C1266V18, CY7C1277V18 CY7C1268V18, CY7C1270V18

IEEE 1149.1 Serial Boundary Scan (JTAG)

These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8V IO logic levels.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, tie TCK LOW (VSS) to prevent device clocking. TDI and TMS are internally pulled up and may be unconnected. They may alternatively be connected to VDD through a pull up resistor. TDO must be left unconnected. Upon power up, the device comes up in a reset state, which does not interfere with the operation of the device.

Test Access Port – Test Clock

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

Test Mode Select

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. You can leave this pin unconnected if the TAP is not used. The pin is pulled up inter- nally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information about loading the instruction register, see the “TAP Controller State Diagram” on page 14. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register.

Test Data-Out (TDO)

The TDO output pin is used to serially clock data-out from the registers. Whether the output is active depends on the current state of the TAP state machine (see “Instruction Codes” on page 17). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register.

Performing a TAP Reset

A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO pins and scans data into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in “TAP Controller Block Diagram” on page 15. Upon power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary ‘01’ pattern to enable fault isolation of the board level serial test path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This shifts data through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices.

The boundary scan register is loaded with the contents of the RAM input and output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can be used to capture the contents of the input and output ring.

“Boundary Scan Order” on page 18 shows the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in “Identification Register Definitions” on page 17.

TAP Instruction Set

Eight different instructions are possible with the three-bit instruction register. All combinations are listed in “Instruction Codes” on page 17. Three of these instructions are listed as RESERVED and must not be used. The other five instructions are described in this section in detail.

Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction after it is shifted in, the TAP controller must be moved into the Update-IR state.

Document Number: 001-06347 Rev. *D

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Contents Features ConfigurationsFunctional Description Selection GuideLogic Block Diagram CY7C1266V18 Logic Block Diagram CY7C1277V18Logic Block Diagram CY7C1268V18 Logic Block Diagram CY7C1270V18Pin Configurations CY7C1266V18 4M xCY7C1277V18 4M x TMS TDICY7C1268V18 2M x CY7C1270V18 1M xQvld BWSPin Definitions Pin Name Pin DescriptionSynchronous Read/Write Input. When Negative Input Clock InputPower Supply Inputs to the Core of the Device Power Supply Inputs for the Outputs of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Delay Lock Loop DLL Application ExampleTruth Table OperationWrite Cycle Descriptions CommentsRemains unaltered During the data portion of a write sequenceWrite cycle description table for CY7C1270V18 follows.2 Into the deviceWritten into the device. D 359 remains unaltered Into the device. D 80 and D 3518 remain unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller follows.9TAP Controller Block Diagram TAP Electrical CharacteristicsParameter Description Test Conditions Min Max Unit GND ≤ VI ≤ VDDTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDPower Up Sequence in DDR-II+ Sram Power Up SequencePower Up Waveforms DLL ConstraintsElectrical Characteristics DC Electrical CharacteristicsMaximum Ratings Operating RangeCapacitance20 Thermal Resistance20AC Test Loads and Waveforms Parameter Description Test Conditions Max UnitSwitching Characteristics Parameter Min MaxHigh LOWSwitching Waveforms Read/Write/Deselect Sequence29NOP Ordering Information 333 Package Diagram Ball Fbga 15 x 17 x 1.40 mmECN No Issue Date Orig. Description of Change Document HistoryNXR VKN
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