CYDC256B16, CYDC128B16,
CYDC064B16, CYDC128B08,
CYDC064B08
Electrical Characteristics for 3.0V Over the Operating Range
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| CYDC256B16, | CYDC256B16, |
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| CYDC128B16, | CYDC128B16, |
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| CYDC064B16, | CYDC064B16, |
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| CYDC128B08, | CYDC128B08, |
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| CYDC064B08 | CYDC064B08 |
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Parameter | Description |
| P1 I/O | P2 I/O | Min. | Typ. | Max. | Min. | Typ. | Max. | Unit | |||||
| Voltage | Voltage | ||||||||||||||
VOH | Output HIGH Voltage (IOH = | 3.0V (any port) | 2.1 |
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| 2.1 |
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| V | |||||
VOL | Output LOW Voltage (IOL = 2 mA) |
| 3.0V (any port) |
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| 0.4 |
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| 0.4 | V | |||||
VOL ODR | ODR Output LOW Voltage (IOL = 8 mA) | 3.0V (any port) |
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| 0.2 |
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| 0.2 | V | ||||||
VIH | Input HIGH Voltage |
| 3.0V (any port) | 2.0 |
| VDDIO | 2.0 |
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| VDDIO | V | |||||
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| + 0.2 |
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| + 0.2 |
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VIL | Input LOW Voltage |
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| 3.0V (any port) |
| 0.7 |
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| 0.7 | V | ||||||
IOZ | Output Leakage Current |
| 3.0V | 3.0V |
| 1 |
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| 1 | µA | ||||||
ICEX ODR | ODR Output Leakage Current. |
| 3.0V | 3.0V |
| 1 |
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| 1 | µA | ||||||
| VOUT = VCC |
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IIX | Input Leakage Current |
| 3.0V | 3.0V |
| 1 |
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| 1 | µA | ||||||
ICC | Operating Current (VCC = Max., | Ind. | 3.0V | 3.0V |
| 49 | 70 |
| 42 | 60 | mA | |||||
| IOUT = 0 mA) Outputs Disabled |
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ISB1 | Standby Current (Both Ports TTL | Ind. | 3.0V | 3.0V |
| 7 | 10 |
| 7 | 10 | µA | |||||
| Level) CEL and CER ≥ VCC – 0.2, |
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| SEML = SEMR = VCC – 0.2, f = fMAX |
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ISB2 | Standby Current (One Port TTL | Ind. | 3.0V | 3.0V |
| 28 | 40 |
| 25 | 35 | mA | |||||
| Level) CEL CER ≥ VIH, f = fMAX |
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ISB3 | Standby Current (Both Ports | Ind. | 3.0V | 3.0V |
| 6 | 8 |
| 6 | 8 | µA | |||||
| CMOS Level) CEL | & CER ≥ |
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| VCC − 0.2V, SEML and SEMR > |
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| VCC – 0.2V, f = 0 |
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ISB4 | Standby Current (One Port CMOS | Ind. | 3.0V | 3.0V |
| 28 | 40 |
| 25 | 35 | mA | |||||
| Level) CEL CER ≥ VIH, f = fMAX[25] |
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Capacitance[26] |
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Parameter |
| Description |
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| Test Conditions |
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| Max. |
| Unit |
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CIN |
| Input Capacitance |
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| TA = 25°C, f = 1 MHz, |
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| 9 |
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| pF |
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| VCC = 3.0V |
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COUT |
| Output Capacitance |
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| 10 |
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| pF |
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Note:
26. Tested initially and after any design or process changes that may affect these parameters.
Document #: | Page 12 of 26 |
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