Toshiba B9700LANQMR, B-9700-LAN-QM-R, B-SX5T manual Supply Specifications

2. SUPPLY SPECIFICATIONS

EO10-33013B

(Revision Date: Jul. 15, 2008)

2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R)

2.6.5 Cautions for using RFID Tags

1) Lift-up of Print Head

An RFID tag chip or the thermal head may be damaged when the thermal head passes over the chip. This can be prevented by using the ribbon saving module (standard feature for the B-SX5T and optional for the B-SX4T) by which the thermal head is lifted up preventing it from touching the chip when it passes over the chip.

When the thermal head is lifted up, the distance from the platen roller to the head is approximately 1 mm.

2) Storage of RFID Supplies

Do not store RFID tags close to printers, or their communication performance may not be as specified when they are used.

3) Roll-type RFID Supplies

When RFID supplies are to be rolled, roll hardness must be concerned.

Although it depends on the type of glue, tag, and backing paper, RFID-tag embedded labels tend to stay rolled. Especially, when they are wound outside, a media jam error may occur. Unless otherwise specified, it is recommended that the RFID-tag embedded labels be wound inside.

4) Sensor

When the transmissive sensor or reflective sensor is enabled, transmissivity or reflectivity of a label or tag may vary at an RFID-tag embedded area depending on the pattern of an antenna or other factors. In such cases, a manual threshold setting is required in the printer system mode. For details, refer to the B-SX4T/5T Key Operation Specifications (EAA-1379).

5) Cutter

When an RFID label or tag is used in cut issue mode, care must be taken not to cut the antenna or the IC chip of an RFID tag in order not to damage the cutter.

6) Static Electricity

When printing is performed in a place where humidity is low or under some specific conditions, writing data on an RFID tag may fail due to static electricity generated by a label or a ribbon.

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