The HP POD 240a structural sections, metal raceways, wireways, conduit, boxes, and other external intersystem components must be bonded with grounding conductors per NFPA 70 in accordance with NEC (NA) and IEC (EMEA and APJ).
Bonding of Piping Systems and Exposed Structural Steel must comply with NFPA 70 in accordance with NEC (NA) and IEC (EMEA and APJ).
Feature | Specification |
|
|
Grounding pad | A grounding pad is located on the underside of the HP POD 240a at the outside |
| corner of each IT section, under the electrical panel. |
| Grounding pads are located inside the HP POD 240a at ceiling level to bond the |
| sections together and bond the IT racks. |
|
|
Grounding lugs | Grounding lugs cannot be attached to any painted surface. |
| Grounding lugs must be |
|
|
Ground rod system or | Customer must provide an effective grounding system with ground rod or ground well. |
ground well |
|
IMPORTANT: Before installing the HP POD 240a, consult your local AHJ for applicable codes and to review
The grounding electrode conductor connections are located on IT sections A and B of the HP POD 240a.The following figure shows the location for one of the IT sections.
Side view shown
Required facility connections 21