ARM CM940T B.3 Mechanical details

Specifications

B.3 Mechanical details

The core module is designed to be stackable on a number of different motherboards. Its size allows it to be mounted onto a CompactPCI motherboard while allowing the motherboard to be installed in a card cage.

Figure B-1shows the mechanical outline of the core module.

		148.0
10.0	128.0

0.10

Detail A
HDRA	HDRB
200-way connector	130-way connector	0.81	0.100
Plug on top and	Plug on top and
(4 col x 50 row)	(4 col x 30 row)
socket on underside	socket on underside
	Detail B
	Memory DIMM

Memory DIMM connector is 25º type which overhangs the edge of the board

Detail A		Pin numbers for 200-way plug,
10.0
		viewed from above board
		1	101
	.10
	0	2	102
		3	103

Detail B

Pin numbers for 168-way SDRAM DIMM connector

shown

1

2

85

86

Measurement datum is line shown through pins

Pin numbers for 200-way socket, viewed from below board

1011

102 2

1033

Samtec TOLC series Samtec TOLC series

Connector footprint

Figure B-1 Board outline

B-4 © Copyright ARM Limited 1999. All rights reserved. ARM DUI 0125A