Third-Party Programmers | Cypress 37000 CPLD specs

Ultra37000 CPLD Family

The third programming option for Ultra37000 devices is to utilize the embedded controller or processor that already exists in the system. The Ultra37000 ISR software assists in this method by converting the device JEDEC maps into the ISR serial stream that contains the ISR instruction information and the addresses and data of locations to be programmed. The embedded controller then simply directs this ISR stream to the chain of Ultra37000 devices to complete the desired reconfiguring or diagnostic operations. Contact your local sales office for information on availability of this option.

The fourth method for programming Ultra37000 devices is to use the same programmer that is currently being used to program FLASH370i devices.

For all pinout, electrical, and timing requirements, refer to device data sheets. For ISR cable and software specifications, refer to the UltraISR kit data sheet (CY3700i).

Third-Party Programmers

As with development software, Cypress support is available on a wide variety of third-party programmers. All major third-party programmers (including BP Micro, Data I/O, and SMS) support the Ultra37000 family.

Document #: 38-03007 Rev. *E

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Cypress 37000 CPLD manual Third-Party Programmers

Contents

Features Ultra37000 5.0V DevicesUltra37000V 3.3V Devices Cypress Semiconductor Corporation Selection Guide Logic Block Architecture Overview of Ultra37000 FamilyProgrammable Interconnect Matrix Product Term Allocator Ultra37000 Macrocell O and Buried Macrocells Input Macrocell Timing Model Development Software Support Jtag and PCI Standards Third-Party Programmers CY37064/CY37064VInput Logic Block DiagramsCY37032/CY37032V CY37128/CY37128V CY37192/CY37192V Logic Block Diagrams CY37256/CY37256V CY37384/CY37384V TMS CY37512/CY37512V 0V Device Characteristics Maximum Ratings Operating Range2Range Output Condition Endurance Characteristics5 3V Device Characteristics Maximum RatingsInductance5 Capacitance5 AC Characteristics Switching Characteristics Over the Operating Range Pipelined Mode Parameters Reset/Preset ParametersParameter Description Unit Product Term Clocking Parameters User Option Parameters Reset/Preset SynchronousProduct Term Operating Frequency Parameters Switching Waveforms User OptionJtag Timing Combinatorial Output Latched Output Latched Input Registered InputClock to Clock Asynchronous Reset Asynchronous PresetOutput Enable/Disable Latched Input and Output CY37064 Power ConsumptionTypical 5.0V Power Consumption CY37032 Typical 5.0V Power Consumption CY37128 CY37192 Typical 5.0V Power Consumption CY37256 CY37384 Typical 5.0V Power Consumption CY37512 Typical 3.3V Power Consumption CY37032V Typical 3.3V Power Consumption CY37064V CY37128V Typical 3.3V Power Consumption CY37192V CY37256V Typical 3.3V Power Consumption CY37384V CY37512V Pin Plcc J67 / Clcc Y67 Top View Pin Configurations20Pin Tqfp A44 Top View Ball Fine-Pitch BGA BA50 Top View Lead Plcc J83 / Clcc Y84 Top View Lead Tqfp A100 Top View Ball Fine-Pitch BGA BB100 for CY37064V Top View Ball Fine-Pitch BGA BB100 for CY37128V Top View CLK3/I4 GND Lead Tqfp A160 for CY37192V Top View TDO I/O Lead Pqfp N208 / Cqfp U208 Top View I/O I/O I/O I/O I/O I/O I/O I/O Ball Pbga BG292 Top View Ball Fine-Pitch BGA BB256 Top View Lead Pbga BG388 Top View Ball Fine-Pitch BGA BB400 Top View Ordering Information 0V Ordering Information Lead Plastic Leaded Chip Carrier CY37064P84-154JC CY37128P84-167JC Lead Plastic Quad Flat Pack CY37256P256-154BGC 3V Ordering Information BB100 Lead Plastic Quad Flat Pack CY37256VP256-100BGC Lead Lead Pb-Free Plastic Leaded Chip Carrier J67 Package DiagramsLead Lead Pb-Free Thin Plastic Quad Flat Pack A44 Lead Ceramic Leaded Chip Carrier Y67 Ball 7.0 mm x 7.0 mm x 1.2 mm, 0.80 pitch Thin BGA BA48D Lead Lead Pb-Free Plastic Leaded Chip Carrier J83 Lead Ceramic Leaded Chip Carrier Y84 Lead Lead Pb-Free Thin Plastic Quad Flat Pack Tqfp A100 Ball Thin Ball Grid Array 11 x 11 x 1.4 mm BB100 51-85049-*B Lead Ceramic Quad Flatpack Cavity Up U162 Detail a Lead Plastic Quad Flatpack N208 Lead Ceramic Quad Flatpack Cavity Up U208 Ball Fbga 17 x 17 mm BB256 Bottom View Ball Plastic Ball Grid Array Pbga 27 x 27 x 2.33 mm BG292 Ball Plastic Ball Grid Array Pbga 35 x 35 x 2.33 mm BG388 Ball Fbga 21 x 21 x 1.4 mm BB400 3V ± Addendum 3V Operating RangeCommercial Issue Orig. Description of Change Date Document History