CY7C1380D, CY7C1382D
CY7C1380F, CY7C1382F
Document #: 38-05543 Rev. *F Page 20 of 34
Capacitance [19]
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 2.5V
589pF
CCLK Clock Input Capacitance 5 8 9 pF
CIO Input/Output Capacitance 5 8 9 pF
Thermal Resistance [19]
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, in accordance with
EIA/JESD51.
28.66 23.8 20.7 °C/W
ΘJC Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
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