Cypress CY7C1380D, CY7C1380F, CY7C1382D, CY7C1382F

CY7C1380D, CY7C1382D

CY7C1380F, CY7C1382F

Document #: 38-05543 Rev. *F Page 3 of 34

Pin Configurations

100-Pin TQFP Pinout (3-Chip Enable)

Figure 1. CY7C1380D, CY7C1380F(512K X 36) Figure 2. CY7C1382D, CY7C1382F (1M X 18)

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Contents

Main CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F 18-Mbit (512K x 36/1M x 18) Pipelined SRAM Features Functional Description Selection Guide CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F Logic Block Diagram CY7C1380D/CY7C1380F [3] (512K x 36) WRITE DRIVER GW CE Page 119-Ball BGA Pinout 165-Ball FBGA Pinout (3-Chip Enable) 2345671 A B C D E F G H J K L M N P R 891011 2345671 A B C D E F G H J K L M N P R 891011 Page Page CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F Functional Overview Single Read Accesses Single Write Accesses Initiated by ADSP Single Write Accesses Initiated by ADSC Burst Sequences Sleep Mode Truth Table Truth Table for Read/Write IEEE 1149.1 Serial Boundary Scan (JTAG) Disabling the JTAG Feature TAP Controller State Diagram Test Access Port (TAP) TAP Controller Block Diagram CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F TAP Instruction Set Reserved TAP Ti min g TAP AC Switching Characteristics Over the Operating Range [10, 11] 3.3V TAP AC Test Conditions 2.5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions Identification Register Definitions Scan Register Sizes Identification Codes 119-Ball BGA Boundary Scan Order[14, 15] 165-Ball BGA Boundary Scan Order [14, 16] Maximum Ratings Operating Range Electrical Characteristics Capacitance Thermal Resistance Figure 9. AC Test Loads and Waveforms = 1.5V (c) (a) (b) V Switching Characteristics Switching Waveforms Figure 10. Read Cycle Timing Figure 11. Write Cycle Timing 27.Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW. Figure 12. Read/Write Cycle Timing Figure 13. ZZ Mode Timing Ordering Information Page Page Package Diagrams Figure 14. 100-Pin Thin Plastic Quad Flat Pack (14 x 20 x 1.4 mm) (51-85050) A Page Figure 16. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180) Package Diagrams SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) 1.40 MAX. 51-85180-*A SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD) Document History Page Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC Solutions