Emerson RTM-ATCA-F120-OPT 2.3.2 Power Requirements

Hardware Preparation and Installation

RTM-ATCA-F120-OPT Installation and Use (6806800G29C) 27

2.3.2 Power Requirements

The RTM has a typical power dissipation of 22W, and a maximum power dissipation of 30W.

Table 2-1 Environmental Requirements

Requirement Operating Non-Operating

Temperature 0ºC to +40ºC (normal operation) according

to NEBS Standard GR-63-CORE

0ºC to +55ºC (exceptional operation)

according to NEBS Standard GR-63-CORE

-40ºC to +85ºC

Temp. Change +/- 0.25ºC/min according to NEBS

Standard GR-63-CORE

+/- 0.25ºC/min

Rel. Humidity 5% to 95% non-condensing according to

Emerson-internal environmental

requirements

5% to 95% non-condensing

according to Emerson-internal

environmental requirem ents

Vibration 0.1g from 5 to 100 Hz and back to 5 Hz at

a rate of 0.1 octave/minute

5-20 Hz @ 0.01 g2/Hz

20-200 Hz @ -3.0 dB/octave

Random 5-20 Hz @ 1 m2/Sec3

Random 20-200 Hz @ -3 m/Sec2

Shock Half-sine, 11 m/Sec, 30mSec/sec2Blade level packaging

Half-sine, 6 mSec at 180 m/Sec2

Free Fall 1,200 mm/all edges and corners

1.0m (Packaged) per ETSI 300

019-2-2 (Blade level packaging)

100mm (unpackaged) per GR-63-

CORE

Contents

Main Trademarks Notice Limited and Restricted Rights Legend Contact Address Contents Page List of Tables Page List of Figures Page About this Manual Overview of Contents Abbreviations Conventions The following table describes the conventions used throughout this manual. Summary of Changes This manual has been revised and replaces all prior editions. Page Safety Notes Electrical Interference Safety Notes Operation Installation Safety Notes SFP/SFP+ Modules Environment Sicherheitshinweise EMV Operation Installation SFP/SFP+ Modules Umweltschutz Chapter 1 Introduction 1.1 Features Page Introduction 1.2 Standard Compliances For Declaration of Conformity refer, RTM Declaration of Conformity.. This RTM-ATCA-F120-OPT meets the following standards. Table 1-1 Standard Compliances Page Chapter 2 Hardware Preparation and Installation 2.1 Overview 2.2 Unpacking and Inspecting the RTM 2.3 Environmental and Power Requirements 2.3.1 Environmental Requirements 2.3.2 Power Requirements The RTM has a typical power dissipation of 22W, and a maximum power dissipation of 30W. Table 2-1 Environmental Requirements 2.4 Installing and Removing the RTM 2.4.1 Installing the RTM Page Page Page Page 2.4.2 Removing the RTM Page 2.5 Installing and Removing SFP/ SFP+ Modules Page Page Page Page Page Controls, LEDs and Connectors 3.2 LEDs and Interface Connectors The following figure shows the face plate of the RTM. Figure 3-1 Face Plate 3.2.1 LEDs The RTM provides four LEDs at its face plate. Their meaning is described in the following table. 3.2.2 Interface Connectors The RTM provides access to the following interfaces at its face plate. Table 3-1 Face Plate LEDs Page Figure 3-2 Location of Ethernet Fabric Channel Uplink Interfaces Fabric Channel - 1 Gbit Ethernet uplink 3.2.2.1.1 10 GBit Fabric Interface Channel Uplinks 3.2.2.1.2 1 GBit Fabric Interface Uplinks 3.2.2.2 Base Channel Interface Connectors Base interface- 10 GBit Ethernet uplink Base interface - 10 GBit Ethernet uplink 3.2.2.2.1 10 GBit Base Interface Uplinks 3.2.2.2.2 1 GBit Base Interface Uplinks 3.2.2.3 SFP/SFP+ Module Hot Swap 3.2.2.4 Telecom Clocking Connectors CH3 CH2 Page Figure 3-5 Location of Serial Interface Connectors Serial Interface Connector Page Functional Description 4.2 Block Diagram The following figure shows the main functional blocks of the RTM. Figure 4-1 Block Diagram RTM Face Plate Zone 3 Connectors 4.3 Mezzanine Management Controller Table 4-1 IPMI Sensors Overview (continued) The following figure shows the location of the on-board temperature sensors. Table 4-1 IPMI Sensors Overview (continued) Page Page Page Appendix A A.1 Emerson Network Power - Embedded Computing Documents Page Index Page Page HOW TO REACH LITERATURE AND TECHNICAL SUPPORT: