EM78P447N

8-Bit Microcontroller with OTP ROM

APPENDIX

A Package Types

OTP MCU

 

Package Type

 

Pin Count

 

Package Size

EM78P447NCP

 

DIP

 

20

 

300 mil

EM78P447NCM

 

SOP

 

20

 

300 mil

EM78P447NDK

 

Skinny DIP

 

24

 

300 mil

EM78P447NDM

 

SOP

 

24

 

300 mil

EM78P447NAP

 

DIP

 

28

 

600 mil

EM78P447NAM

 

SOP

 

28

 

300 mil

EM78P447NAS

 

SSOP

 

28

 

209 mil

EM78P447NBP

 

DIP

 

32

 

600 mil

EM78P447NBWM

 

SOP

 

32

 

450 mil

B Package Information

20-Lead plastic dual inline packageDIP)- 300 mil

 

Symbal

Min

Normal

Max

E

A

 

 

4.450

 

 

 

 

A1

0.381

 

 

 

A2

3.175

3.302

3.429

 

c

0.203

0.254

0.356

 

D

25.883

26.060

26.237

 

E1

6.220

6.438

6.655

 

E

7.370

7.620

7.870

 

eB

8.510

9.020

9.530

 

B

0.356

0.457

0.559

 

B1

1.143

1.524

1.778

 

L

3.048

3.302

3.556

 

e

 

2.540(TYP)

 

 

θ

0

 

15

A2

A1

TITLE:

PDIP-20L 300MIL PACKAGE OUTLINE

DIMENSION

File :

Edtion: A

D20

 

 

Unit : mm

 

Scale: Free

 

Material:

 

Sheet:1 of 1

50

Product Specification (V1.1) 03.30.2005

(This specification is subject to change without further notice)

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IBM EM78P447N manual Lead plastic dual inline package(DIP)- 300 mil, Package Type Pin Count Package Size