EM78P447N

8-Bit Microcontroller with OTP ROM

24-Lead plastic dual inline skinny packageDIP)- 300 mil

24

13

Symbal

Min

Normal

Max

 

E

 

 

A

 

 

5.334

 

 

A1

0.381

 

 

 

 

A2

3.175

3.302

3.429

 

 

c

0.203

0.254

0.356

 

 

D

31.750

31.801

31.852

 

 

E1

6.426

6.628

6.830

1

12

E

7.370

7.620

7.870

eB

8.380

8.950

9.520

 

 

 

 

B

0.356

0.457

0.559

 

 

B1

1.470

1.520

1.630

 

 

L

3.048

3.302

3.556

 

 

e

 

2.540(TYP)

 

 

 

θ

0

 

15

 

A2

 

 

 

 

 

A1

 

 

 

 

e

TITLE:

PDIP-24L SKINNY 300MIL PACKAGE

OUTLINE DIMENSION

File :

Edtion: A

K24

 

 

Unit : mm

 

Scale: Free

 

Material:

 

Sheet:1 of 1

28-Lead plastic dual inline packageDIP)- 600 mil

Product Specification (V1.1) 03.30.2005

51

(This specification is subject to change without further notice)

Page 55
Image 55
IBM EM78P447N manual Lead plastic dual inline skinny package(DIP)- 300 mil, Lead plastic dual inline package(DIP)- 600 mil