IBM EM78P447N manual Lead plastic dual inline package(DIP)- 600 mil, 0.838

Models: EM78P447N

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32-Lead plastic dual inline package(DIP)- 600 mil

EM78P447N

8-Bit Microcontroller with OTP ROM

32-Lead plastic dual inline packageDIP)- 600 mil

b

20-Lead plastic small outline packageSOP)- 300 mil

Symbal

Min

Normal

Max

A

2.350

 

2.650

A1

0.102

 

0.300

b

 

0.406(TYP)

 

c

0.230

 

0.320

E

7.400

 

7.600

H

10.000

 

10.650

D

12.600

 

12.900

L

0.630

0.838

1.100

e

 

1.27(TYP)

 

θ

0

 

8

e

c

TITLE:

 

SOP-20L(300MIL) PACKAGE OUTLINE

DIMENSION

 

File :

Edtion: A

SO20

 

 

Unit : mm

 

Scale: Free

 

Material:

 

Sheet:1 of 1

52

Product Specification (V1.1) 03.30.2005

(This specification is subject to change without further notice)

Page 56
Image 56
IBM EM78P447N Lead plastic dual inline package(DIP)- 600 mil, Lead plastic small outline package(SOP)- 300 mil, 0.838