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Intel 955X manual

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Intel® 955X Express Chipset

Thermal/Mechanical Design Guide

–For the Intel® 82955X Memory Controller Hub (MCH)

April 2005

Document Number: 307012-001

Contents

Intel® 955X Express Chipset Page Contents Figures Tables Revision History Page 1 Introduction 1.1Definition of Terms 1.2Reference Documents 2 Packaging Technology 2.1Package Mechanical Requirements 3 Thermal Specifications 3.1Thermal Design Power (TDP) 3.2Die Case Temperature Specifications Page 4 Thermal Simulation Page 5 Thermal Metrology 5.1Die Case Temperature Measurements 5.1.1Zero Degree Angle Attach Methodology Page 6 Reference Thermal Solution 6.1Operating Environment 6.2Heatsink Performance 6.3Mechanical Design Envelope Page 6.4Board-LevelComponents Keep-outDimensions 6.5Reference Heatsink Thermal Solution Assembly 6.5.1Heatsink Orientation 6.5.2Extruded Heatsink Profiles 6.5.3Mechanical Interface Material 6.5.4Thermal Interface Material 6.5.5Heatsink Clip 6.5.6Clip Retention Anchors 6.6Reliability Guidelines Page 7Appendix A: Thermal Solution Component Suppliers Page 8 Appendix B: Mechanical Drawings

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