Intel 955X 6.3Mechanical Design Envelope

Reference Thermal Solution

R

Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach Velocity

6.3Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the MCH thermal solution are shown in Figure 6-2.

When using heatsinks that extend beyond the MCH reference heatsink envelope shown in Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2.2 mm (0.087 in.) in height.

18 Intel® 955X Express Chipset Thermal/Mechanical Design Guide