R
Figure 2-1. MCH Package Dimensions (Top View)............................................................
9
Figure 2-2. MCH Package Dimensions (Side View)...........................................................
Figure 2-3. MCH Package Dimensions (Bottom View).....................................................
10
Figure 5-1. Thermal Solution Decision Flowchart.............................................................
16
Figure 5-2. Zero Degree Angle Attach Methodology ........................................................
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)......................................
Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach
Velocity ......................................................................................................................
18
Figure 6-2. Heatsink Volumetric Envelope for the MCH...................................................
19
Figure 6-3. MCH Heatsink Board Component Keep-out ..................................................
20
Figure 6-4. Retention Mechanism Component Keep-out Zones ......................................
21
Figure 6-5. Plastic Wave Soldering Heatsink Assembly...................................................
22
Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile ........................................
23
Figure 8-1. Plastic Wave Soldering Heatsink Assembly Drawing ....................................
30
Figure 8-2. Plastic Wave Soldering Heatsink Drawing
(1 of 2)........................................
31
Figure 8-3. Plastic Wave Soldering Heatsink Drawing
(2 of 2)........................................
32
Figure 8-4. Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2).......................
33
Figure 8-5. Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2).......................
34
Figure 8-6. Plastic Wave Soldering Heatsink Wire Clip Drawing .....................................
35
Figure 8-7. Plastic Wave Soldering Heatsink Solder-Down Anchor Drawing ..................
36
Table 3-1. MCH Thermal Specifications ...........................................................................
11
Table 6-1 Honeywell PCM 45F TIM Performance as a Function of Attach Pressure ......
24
Table 6-2.
Reliability Guidelines .......................................................................................
25
Table 7-1.
MCH Heatsink Thermal Solution .....................................................................
27
Table 8-1.
Mechanical Drawing List..................................................................................
29
4
Intel® 955X Express Chipset Thermal/Mechanical Design Guide
