Intel 955X 6.5.1Heatsink Orientation, 6.5.2Extruded Heatsink Profiles

Reference Thermal Solution

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Figure 6-5. Plastic Wave Soldering Heatsink Assembly

6.5.1Heatsink Orientation

To enhance the efficiency of the reference thermal solution, it is important for the designer to orient the fins properly with respect to the mean airflow direction. Simulation and experimental evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are aligned with the mean airflow direction (see Figure 6-3).

6.5.2Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the MCH. Figure 6-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B.

22 Intel® 955X Express Chipset Thermal/Mechanical Design Guide