Reference Thermal Solution
R
Figure
6.5.1Heatsink Orientation
To enhance the efficiency of the reference thermal solution, it is important for the designer to orient the fins properly with respect to the mean airflow direction. Simulation and experimental evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are aligned with the mean airflow direction (see Figure
6.5.2Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the MCH. Figure
22 | Intel® 955X Express Chipset Thermal/Mechanical Design Guide |