Reference Thermal Solution
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6 Reference Thermal Solution
Intel has developed a reference thermal solution designed to meet the cooling needs of the MCH under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Plastic Wave Soldering Heatsink (PWSH) reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions. For information on the ICH7, refer to thermal specification in the Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines.
6.1Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of 55 °C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 350 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35 °C external-ambient temperature at sea level. (External-ambient refers to the environment external to the system.)
6.2Heatsink Performance
Figure 6-1depicts the measured thermal performance of the reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.
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